-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
SEMI-FlexTech Announces 2020 FLEXI Awards Winners for Outstanding Achievements in Flexible Hybrid Electronics
February 27, 2020 | SEMI-FlexTechEstimated reading time: 3 minutes

Recognizing innovations and other outstanding accomplishments in Flexible Hybrid Electronics (FHE), SEMI-FlexTech, a SEMI Strategic Association Partner, yesterday presented the 2020 FLEXI Awards at the 19th annual FLEX 2020 Conference and Exhibition in San Jose, California. The FLEXI Awards spotlight FHE contributions in five categories: R&D Achievement, Product Innovation and Commercialization, Technology & Education in Leadership, Technology Champion and Industry Leadership.
R&D Achievement—Epicore Biosystems won the FLEXI for its world-class research of a soft, skin-interfaced bioelectronics platform with high commercial potential. The platform leverages microfluidics to capture biochemical/biophysical markers on fatigability in heart failure patients. Award criteria include research approach, originality and commercial potential for expanding the bounds of flexible or printed electronics.
“We are honored to receive this prestigious award for our multifunctional wearable systems and privileged to be an active member in this growing community of flexible hybrid electronics researchers and industry partners,” said Roozbeh Ghaffari, CEO and Co-Founder of Epicore Biosystems.
Product Innovation—PragmatIC won the FLEXI for product design and ingenuity in developing its ConnectIC family. The award recognizes an FHE product, announced over the past year, with significant potential or proven market adoption and revenue generation.
“PragmatIC is delighted that our ConnectIC flexible integrated circuits have won the FLEXI,” said Scott White, CEO at PragmatIC. “By bringing intelligence and connectivity to trillions of everyday objects, we see these products playing a pivotal role in improving our environment and daily lives.”
Technology Champion & Leadership in Education—NextFlex received the FLEXI for FlexPro, a program that immerses working professionals into the development, manufacturability, and applications that can benefit from FHE technology.
“NextFlex is extremely pleased to receive this prestigious recognition for FlexPro, our professional development education program,” said Emily McGrath, Director of Workforce Development Programs at NextFlex. “This program is central to our strategy of proliferating knowledge about flexible hybrid electronics throughout the advanced manufacturing sector in the U.S. Through our workforce development programs, we raise awareness of the benefits of FHE – thin, flexible, lightweight and fast to market – while improving collaboration throughout the manufacturing ecosystem, resulting in broader adoption and commercialization.”
Technology Champion—Dr. Meyya Meyyappan, Chief Scientist for Exploration Technology at the Center for Nanotechnology, NASA Ames Research Center, won the FLEXI for his technical leadership in printed and flexible electronics, outreach activities and tireless volunteering to promote the field.
“Applications for flexible and hybrid electronics have been picking up in every sector rapidly, and we can look forward to interesting developments in the near future,” said Dr. Meyyappan.
Industry Leadership—FlexTech Chairman Dr. Michael McCreary won a FLEXI for his dedication and involvement in the commercialization of FHE, unwavering efforts to forge an industry vision, and contributions to technical developments.
“I am honored to receive this award and privileged to have worked with the SEMI FlexTech leadership and its member companies on emerging flexible and printed electronics technology for almost two decades, including forming the alliances that gave rise to the current FlexTech organization,” Dr. Michael McCreary said. “I am gratified to see technology in the marketplace today that FlexTech enabled with R&D funding during its critical formative years. I look forward to seeing more collaborations and successes well into the future.“
About the FLEXI AWARDS
FLEXIs have been the industry’s premier award for distinguished organizations and individuals since 2009. The awards are sponsored by SEMI-FlexTech, an organization dedicated to the success of the FHE sector.
About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Suggested Items
TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS
07/18/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
Hyliion Awarded U.S. Navy Contract to Advance Multi-Unit KARNO Power Module
07/18/2025 | BUSINESS WIREHyliion Holdings Corp., a leading provider of innovative KARNOTM Power Modules, announced it has been awarded a Phase II Small Business Innovation Research (SBIR) contract in the amount of $1.5 million from the U.S. Navy to further develop and refine its scalable multi-megawatt platform for shipboard and stationary military applications.
Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.