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Sivers Semiconductors, Doosan Partner to Develop Leading-Edge Ka-Band SATCOM Antenna Panels

11/25/2025 | PRNewswire
Sivers Semiconductors AB, a global leader in photonics and wireless technologies, today announced a new collaboration with Doosan Corporation, a global leader in advanced materials and manufacturing solutions, to develop scalable electronically steerable array (ESA) panels in the Ka-band for satellite communications (SATCOM).

Fairbanks Morse Defense to Acquire Truflo Marine from IMI

11/25/2025 | BUSINESS WIRE
Fairbanks Morse Defense (FMD), a portfolio company of Arcline Investment Management, has entered into an agreement with IMI plc, to acquire its Birmingham, UK-based Truflo Marine business.

OKI Launches Projection Assembly System in Southeast Asia

11/25/2025 | OKI
OKI launched its Projection Assembly System in Thailand and Indonesia, which supports assembly and quality inspection processes, driving the digital transformation (DX) of manufacturing sites on November 25, 2025.

productronica 2025: Showcasing the Future of Electronics Manufacturing for 50 Years

11/25/2025 | Marcy LaRont, I-Connect007
Last week’s productronica 2025 at Messe München in Munich marked a significant milestone for the European electronics manufacturing industry. The biennial show celebrated its 50th anniversary, highlighting five decades of technological transformation as the largest global trade fair for electronics manufacturing. Co-located with Semicon Europa, productronica attracted an attendance of over 47,000 visitors, featuring more than 1,600 exhibitors from over 50 countries.

Connect the Dots: The Future of Designing for Reality—Electroless Copper

11/25/2025 | Matt Stevenson -- Column: Connect the Dots
On a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity. 
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