Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
iNEMI PCB Warpage Characterization and Minimization Webinar
April 17, 2020 | iNEMIEstimated reading time: 1 minute
PCB Warpage Characterization and Minimization End-of-Project Webinar: May 13?14, 2020
The use of thinner components and thinner multi-up panel PCBs (? 40 mils) has exacerbated PCB warpage issues in SMT assembly which, in turn, can negatively impact PCB assembly yield.
iNEMI’s PCB Warpage Characterization and Minimization project studied key design and fabrication factors for thin PCBs to determine the impact on warpage. The project analyzed the effects of:
- PCB post processing (bake & no bake PCB)
- Panel locations (corner & center)
- PCB thicknesses (0.8 mm & 0.6 mm)
- Material properties (mid Tg and high Tg)
- PCB fabrication processing
The resulting PCB warpage was evaluated using high temperature warpage measurement metrology to evaluate the ball grid arrays (BGA) and panel area PCB coplanarity. The project team will report on the analysis of the results and recommendations.
Registration
This webinar is open to iNEMI members and non-members. Advance registration is required. Two sessions are scheduled; please click below to register for a session.
Session 1 (Americas and EMEA)
Wednesday, May 13
11:00 a.m.-12:00 p.m. EDT (North America)
5:00-6:00 p.m. CEST (Europe)
Register for webinar
Session 2 (APAC and Americas)
Thursday, May 14
9:00-10:00 a.m. CST (China)
6:00-7:00 p.m. PST (North America) on Wednesday, May 13
Register for webinar
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Naprotek Appoints Mark Crebs to Lead Business Development for Products and Platforms
08/27/2025 | Naprotek LLCNaprotek, LLC, a leading provider of mission-critical electronics technology solutions, announced the appointment of Mark Crebs to Products and Platform Director of Business Development.