-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec High Performance IMS Dielectric Material VT-4B5H Receives UL-Authorization
April 29, 2020 | Ventec International Group Co., Ltd.Estimated reading time: 2 minutes

Ventec International Group Co., Ltd., is pleased to announce that UL’s evaluation of Ventec’s high-performance ceramic-filled, non-reinforced IMS dielectric material has received authorization to apply the UL mark and has thus been recognized for achieving 155°C maximum operating temperature (MOT) for electric and mechanical RTI (Relative Temperature Index).
UL's investigation of Ventec's VT-4B5H metal base laminate has been completed and was determined to comply with the applicable requirements including 155oC MOT (maximum operating temperature) for electric and mechanical RTI (Relative Temperature Index). With thermal conductivity of 4.2 W/m*K and glass transition temperature (Tg) of 180°C, the versatile IMS material is the perfect choice for use in extreme high temperature applications. These include DC/DC power modules, IGBT applications, motor controllers, high lumen output LED devices, battery charging, OBC chargers for EV vehicles and several other automotive “underhood” applications. VT-4B5H is also highly recommended for chip on board (COB) or direct die in both power and LED applications.
VT-4B5H is available in a wide range of dielectric-, copper foil- and base plate thicknesses and types as well as in numerous panel size options. This versatility is ideal for both single layer and multiple layer IMS designs.
Chris Hanson, Global Head IMS Technology, commented: "Achieving UL authorization for VT-4B5H’s industry-leading 155°C MOT performance is fantastic news. As a complement to our full VT-4B series of superior thermal dissipation materials, our customers have access to an IMS material that meets virtually any high thermal performance requirements."
Ventec International is a world leader in the production of polyimide and high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper-clad glass-reinforced and metal-backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- and high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
For more information, visit www.venteclaminates.com.
Suggested Items
Designers Notebook: Addressing Future Challenges for Designers
02/06/2025 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board is and will probably continue to be the base platform for most electronics. With the proliferation of new generations of high I/O, fine-pitch surface mount semiconductor package variations, circuit interconnect is an insignificant factor. Circuit board designers continually face challenges such as component quantity and complexity, limited surface area, and meeting the circuit board’s cost target. The printed circuit design engineer’s prominent position demands the development of efficiently manufacturable products that perform without compromise.
DesignCon 2025, Day 2: It’s All About AI
01/30/2025 | Marcy LaRont, I-Connect007It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.
Beyond Design: Electro-optical Circuit Boards
01/22/2025 | Barry Olney -- Column: Beyond DesignPredicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.