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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Ventec High Performance IMS Dielectric Material VT-4B5H Receives UL-Authorization
April 29, 2020 | Ventec International Group Co., Ltd.Estimated reading time: 2 minutes

Ventec International Group Co., Ltd., is pleased to announce that UL’s evaluation of Ventec’s high-performance ceramic-filled, non-reinforced IMS dielectric material has received authorization to apply the UL mark and has thus been recognized for achieving 155°C maximum operating temperature (MOT) for electric and mechanical RTI (Relative Temperature Index).
UL's investigation of Ventec's VT-4B5H metal base laminate has been completed and was determined to comply with the applicable requirements including 155oC MOT (maximum operating temperature) for electric and mechanical RTI (Relative Temperature Index). With thermal conductivity of 4.2 W/m*K and glass transition temperature (Tg) of 180°C, the versatile IMS material is the perfect choice for use in extreme high temperature applications. These include DC/DC power modules, IGBT applications, motor controllers, high lumen output LED devices, battery charging, OBC chargers for EV vehicles and several other automotive “underhood” applications. VT-4B5H is also highly recommended for chip on board (COB) or direct die in both power and LED applications.
VT-4B5H is available in a wide range of dielectric-, copper foil- and base plate thicknesses and types as well as in numerous panel size options. This versatility is ideal for both single layer and multiple layer IMS designs.
Chris Hanson, Global Head IMS Technology, commented: "Achieving UL authorization for VT-4B5H’s industry-leading 155°C MOT performance is fantastic news. As a complement to our full VT-4B series of superior thermal dissipation materials, our customers have access to an IMS material that meets virtually any high thermal performance requirements."
Ventec International is a world leader in the production of polyimide and high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com and/or by downloading the Ventec APP.
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper-clad glass-reinforced and metal-backed substrates. Ventec materials, which include high-quality enhanced FR-4, high-speed/low-loss- and high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
For more information, visit www.venteclaminates.com.
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