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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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TTM Technologies, Inc. Announces Upcoming Conference Participation
May 7, 2020 | GlobeNewswireEstimated reading time: Less than a minute
TTM Technologies, Inc., a leading global printed circuit board (PCB) and radio frequency (RF) components manufacturer, today announced that members of its management team will virtually present at the following investor conferences:
- The J.P. Morgan Technology, Media, and Communications Conference on May 12th, 2020 at 4:10pm Eastern Time
- The Needham Technology and Media Conference May 19th, 2020 at 1:45pm Eastern Time
- The Baird Global Consumer, Technology and Services Conference on June 3th, 2020 at 3:10pm Eastern Time
- The Stifel Cross Sector Insight Conference on June 9th. After our presentation time has been finalized, we will post this event to our website
All presentations will be webcast live on the company’s website, www.ttm.com, and a replay will be accessible for a limited time following the events.
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BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding