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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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TTM Technologies, Inc. Announces Upcoming Conference Participation
May 7, 2020 | GlobeNewswireEstimated reading time: Less than a minute
TTM Technologies, Inc., a leading global printed circuit board (PCB) and radio frequency (RF) components manufacturer, today announced that members of its management team will virtually present at the following investor conferences:
- The J.P. Morgan Technology, Media, and Communications Conference on May 12th, 2020 at 4:10pm Eastern Time
- The Needham Technology and Media Conference May 19th, 2020 at 1:45pm Eastern Time
- The Baird Global Consumer, Technology and Services Conference on June 3th, 2020 at 3:10pm Eastern Time
- The Stifel Cross Sector Insight Conference on June 9th. After our presentation time has been finalized, we will post this event to our website
All presentations will be webcast live on the company’s website, www.ttm.com, and a replay will be accessible for a limited time following the events.
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ViTrox’s HITS 5.0 Empowers Global Partners with Innovative Solutions and Stronger Bonds
07/16/2025 | ViTroxViTrox, strives to be the World’s Most Trusted Technology Company, proudly announces the successful conclusion of its fifth edition of High Impact Training for Sales (HITS 5.0), held from 23rd to 27th June 2025 at ViTrox Campus 2.0 and 3.0, located in Batu Kawan Industrial Park, Penang, Malaysia.
Global Citizenship: The Global Push for Digital Inclusion
07/16/2025 | Tom Yang -- Column: Global CitizenshipIt can be too easy to take the technology at our fingertips for granted: high-speed internet, cloud-based collaboration, and instant video calls across continents. Yet, for billions of people, access to these digital tools is a distant dream. As a global community, we must ensure that technology is available to all. Here is how technology is bridging physical, economic, and educational gaps in underserved regions and profoundly reshaping lives.
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.