-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueWet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Atotech to Participate in SEMICON China and CSTIC 2020
June 19, 2020 | AtotechEstimated reading time: 1 minute
Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging, and dual damascene applications, is pleased to announce its participation in this year’s SEMICON China, held at the Shanghai New International Expo Center from June 27 – 29. CSTIC will be held as a virtual conference in conjunction with SEMICON China from June 26 – July 17, 2020.
Atotech’s experts will be present at booth E5317 and visitors are welcome to discuss the company’s latest innovations, future developments and trends in the electronics industry.
Highlights at the booth will include:
- Spherolyte® Cu UF3 – high-purity ECD Copper process that enables high-speed plating of pure Copper for pillar applications.
- Xenolyte® Zincate CFA2 – universal pretreatment process for all types of Aluminum and Aluminum alloy wafers.
- Xenolyte® Pd HS – pure Palladium deposits for high-reliability pad metallization and RDL housing.
- MultiPlate® ECD system for power IC – simultaneous Copper deposition for embedding power chips.
- NEAP X.1 / X.2 – next generation through-hole and blind micro via filling process for use in VCP systems with insoluble anodes.
SuperDip 21N – Atotech’s 2-in-1 anti-tarnish and anti-EBO post-treatment for leadframe application on both Copper and Silver surfaces and even Nickel/Palladium/Gold.
Atotech is also pleased to announce, that Din-Ghee Neoh, Atotech’s Business Manager for Leadframe and Connector technology, will participate in the virtual conference, CSTIC, with a pre-recorded video presentation. He will discuss: “Enhancing high temperature adhesion performance via a renovated leadframe surface treatment” and his presentation will be available for replay for the entire event (June 26 – July 17).
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: info@atotech.com.
About Atotech
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computing; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
Atotech, headquartered in Berlin, Germany, is a team of 4,000 experts in over 40 countries generating annual revenues of $1.2 billion (2019). Atotech has manufacturing operations across Europe, the Americas, and Asia.
Suggested Items
Atotech to Participate at KPCA Show 2024
09/03/2024 | AtotechMKS’ Atotech will participate in this year’s KPCA Show 2024 in Incheon, held at Songdo Convensia from September 4-6, 2024.
Victory Announces Breakthrough in PCB Technology with New Product Launch
08/29/2024 | openPRShenzhen Victory Electronics Technology Co., Ltd., a leader in the printed circuit board (PCB) manufacturing industry, is proud to announce the successful development of a groundbreaking new product.
Connect the Dots: Designing for Reality—Electroless Copper
08/28/2024 | Matt Stevenson -- Column: Connect the DotsRoll up your sleeves because it's time to get messy. In a recent episode of I-Connect007’s On the Line with… podcast, we discussed electroless copper deposition. This process deposits a copper layer into the through-holes and vias of what will eventually be a PCB. Electroless copper deposition feels like a black box to many people. It sort of looks like a black box, too. The boards go in one side, come out the other, and emerge differently. So, let's crack open that black box and look inside.
Maximizing ROI Through Better Wet Process Control
08/20/2024 | I-Connect007 Editorial Team“When things get out of control, the variation in your wet process begins,” says Mike Carano,. “Just because they look like good boards and may even pass electrical test, it does not necessarily mean you have good boards. Once the chemistry is headed toward the right or left side of the process control parameter cliff, the plating is compromised. If the copper is thinner than it should be, when the customer puts it into service, the board may fail after 500 cycles vs. the requisite 1,000 or 2,000 cycles. The root cause issue is that you plated 7/10ths of a mil of copper instead of one-mil of copper because you were not controlling your process. The fact that you passed your own electric test becomes inconsequential.”
The Chemical Connection: Controlling an Alkaline Etch Bath With Low Copper Loading
08/07/2024 | Don Ball -- Column: The Chemical ConnectionThis month, I wanted to continue my discussion on how much process control is actually needed for high-density circuit production. However, in the last month, I have been called on to help with a specific process control problem: how to control an alkaline etch bath when you’re not etching much copper. This problem has been cropping up more frequently as smaller shops (and a few larger ones) concentrate on low-volume, high-value plated through-hole panels such as prototypes, resistor cores, etc.