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RBP Releases Circutek CC-720 PTH Acid Cleaner Conditioner
August 4, 2020 | RBP Chemical TechnologyEstimated reading time: Less than a minute
RBP Chemical Technology has recently released Circutek CC-720 PTH Acid Cleaner Conditioner.
Circutek CC-720™ is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces including glass fiber fabric and multiple resin systems used in the construction of high-reliability rigid, rigid-flex and flexible printed circuit boards.
The Circutek CC-720 is formulated to affect maximum adsorption of palladium tin catalyst to insure uniform deposition of the subsequent electroless copper deposit.
Positive Customer Impact
Circutek CC-720 provides the fabricator with wide process latitude with respect to enhancing the chemisorption of the palladium-tin catalyst without building up a heavy conditioning film on the interconnect and resin-glass surfaces. The Circutek CC-720 is acidic in nature and is free-rinsing. Many competitive conditioners on the market often over-condition the resin, leaving it difficult to rinse film. This excessive film causes over adsorption of the catalyst that often leads to defects such as hole-wall pullaway (HWPA) and interconnect defect (ICD)
The Circutek CC-720 is another innovation in RBP’s Circutek PTH Process Technology portfolio.
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10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.