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RBP Releases Circutek CC-720 PTH Acid Cleaner Conditioner
August 4, 2020 | RBP Chemical TechnologyEstimated reading time: Less than a minute

RBP Chemical Technology has recently released Circutek CC-720 PTH Acid Cleaner Conditioner.
Circutek CC-720™ is an acidic cleaner/conditioner for use in the electroless copper metallization process in the PCB industry. It is formulated to remove fingerprints, light soil and other contaminants from copper foil. It also conditions non-metallic surfaces including glass fiber fabric and multiple resin systems used in the construction of high-reliability rigid, rigid-flex and flexible printed circuit boards.
The Circutek CC-720 is formulated to affect maximum adsorption of palladium tin catalyst to insure uniform deposition of the subsequent electroless copper deposit.
Positive Customer Impact
Circutek CC-720 provides the fabricator with wide process latitude with respect to enhancing the chemisorption of the palladium-tin catalyst without building up a heavy conditioning film on the interconnect and resin-glass surfaces. The Circutek CC-720 is acidic in nature and is free-rinsing. Many competitive conditioners on the market often over-condition the resin, leaving it difficult to rinse film. This excessive film causes over adsorption of the catalyst that often leads to defects such as hole-wall pullaway (HWPA) and interconnect defect (ICD)
The Circutek CC-720 is another innovation in RBP’s Circutek PTH Process Technology portfolio.
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Material Insight: The Material Science of PCB Thermal Reliability
10/25/2023 | Preeya Kuray -- Column: Material InsightPrinted circuit board (PCB) reliability testing is generally performed by exposing the board to various mechanical, electrical, and/or thermal stimuli delineated by IPC standards, and then evaluating any resulting failure modes. Thermal shock testing is one type of reliability test that involves repeatedly exposing the PCB test board to a 288°C pot of molten solder for a specific time (typically 10 seconds) and measuring the number of cycles it takes for a board’s copper layer to separate from the organic dielectric layer. If there is no delamination, fabricators can rest assured that the board will perform within expected temperature tolerances in the real world.