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In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
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Koh Young Collaborates with Mentor to Further Simplify Inspection System ProgrammingAugust 12, 2020 | Koh Young Technology
Estimated reading time: 3 minutes
Industry leader Koh Young announces it has joined forces with Mentor, a Siemens business, to deliver an enhanced programming solution, which will benefit the printed circuit board assembly market. Building on the AI-powered Koh Young Auto Programming software (KAP), Mentor integrated its Valor™ Process Preparation Software to further simplify Automated Optical Inspection (AOI) programming and reduce production costs by saving time through the implementation of Mentor’s Open Product Model.
“The synergy between our companies has resulted in an outstanding solution that is designed to help reduce time to market and improve production quality across the line,” said Mr. JD Shin, Chief Sales Office for Koh Young Technology. “We are especially excited about this particular collaboration with Mentor, because it was in direct response to the voice of the customer. The partnership highlights the benefits customers can realize when two suppliers work together towards a common goal. It was a win-win for everyone.”
The enhanced software eliminates the need for CAD and Gerber files, which saves time by eliminating the efforts by a programmer to locate, upload, and manipulate these product files. The new solution reduces programming time by blending several elements together that automatically creates the necessary AOI programming files.
One of the elements Koh Young integrated from Mentor includes the Valor Open Product Model (OPM). Introduced in 2018 by Mentor, OPM is an open data assembly format structured in XML, which focuses on the printed circuit board assembly model (PCBA) and the associated manufacturing process plan. OPM is a solution for the open exchange of process engineering information between disparate machines and processes. In the same way that ODB++ works for design data, OPM is the answer to the need for flexibility that Smart Industry 4.0 factories demand.
A second element that is now part of Koh Young software, it the extensive Valor Parts Library (VPL) database from Mentor. Comprised of over 35 million component manufacturers part numbers and package geometry definitions, Valor Process Preparation software uses this information to fully automate the creation of new parts and packages for use in inspection systems and mounters using its “Auto-Generation” rule methodology.
Combining a single assembly format file output like OPM and a standardized machine package library from VPL, the manufacturer minimizes program variations between machines like inspection systems and component mounters. This improved programming approach can eliminate human error and variation, while significantly reducing NPI programming time. Additionally, OPM is generalized so it is interoperable among various systems and easily enables moving production between lines and—more importantly—factories across the world.
“This joint programming project was just the first step in an expanded collaboration to improve the PCBA manufacturing experience for our customer,” said Mr. Rick Esposito, Director of Valor’s Processing Engineering Product Line. “When industry leaders collaborate, remarkable solutions result. We are excited about this relationship and the future together.”
Learn more about Koh Young and its best-in-class portfolio of True 3D smart factory solutions, powered by AI at www.kohyoung.com. For more information about Mentor’s Valor Process Preparation solution, visit https://www.mentor.com/pcb-manufacturing-assembly/products/valor-mss-process-preparation.
About Koh Young
Koh Young, the leading 3D measurement-based inspection equipment and solutions provider, performs an essential role for quality control and process optimization across a growing set of industries including printed circuit board assembly, machining and assembly process manufacturing, semiconductor manufacturing, and various medical fields. In addition to its corporate headquarters in Seoul, Koh Young has sales and support offices in Germany, Japan, Singapore, Penang, China, Brazil, Argentina, Canada, Mexico, and the United States. These local facilities ensure it maintains a close relationship with its growing customer base and provides them with access to a global network of inspection and measurement experts.
Mentor Graphics Corporation, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. Web site: www.mentor.com.
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing09/22/2023 | GlobalFoundries
The U.S. Department of Defense (DoD) has awarded GlobalFoundries (Nasdaq: GFS) (GF) a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
Ever since high density interconnect (HDI) was created in 1982 by Hewlett-Packard to package its first 32-bit computer powered by a single chip, it has continued to evolve and provide the solutions for miniaturized products. The leading edge of HDI technology became the process used for organic flip-chip packaging for the semiconductor industry. The two distinct markets—IC substrates and product-system integration—are now colliding and utilizing the same ultra-HDI manufacturing processes.
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes09/21/2023 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum.
Intraratio to Feature Industry-Leading Smart Manufacturing Solutions at SMTA Guadalajara Expo and Tech Forum 202309/21/2023 | Intraratio
Intraratio, a provider of enterprise software solutions, is pleased to announce its participation in the SMTA Guadalajara Expo and Tech Forum 2023.
SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain's Carbon Emissions09/21/2023 | SEMI
The SEMI Semiconductor Climate Consortium (SCC) issued its first report of the semiconductor ecosystem's greenhouse gas (GHG) emissions profile, an in-depth analysis of the semiconductor value chain's carbon footprint and priority-ranked carbon emission sources for the industry to address.