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Rogers Introduces RO4450T Glass Reinforced Thermoset Multi-Thickness Bondply
August 31, 2020 | Rogers CorporationEstimated reading time: 1 minute

Wireless circuit designers can now enjoy a true breakthrough with Rogers Corporation's RO4450T™ bondply. This product offers designers a spread glass reinforced bonding material in seven thickness options ranging between 0.0025” (0.064mm) and 0.006” (0.152mm), greatly improving flexibility for high multilayer board count designs.
RO4450T glass reinforced thermoset bondplies were developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 materials. The thermosetting hydrocarbon ceramic resin system facilitates a high post cure Tg, making these materials an excellent choice for multilayers requiring sequential laminations as fully cured RO4400 bondplys are capable of handling multiple lamination cycles.
In addition, FR-4 compatible bond requirements permit RO4450T bondply and low flow FR-4 bondply to be combined into non-homogeneous multilayer constructions using a single bond cycle. RO4450T bondplys are recognized by Underwriter Laboratories with the UL 94 V-0 flame rating, and are compatible with lead-free processes.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.
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07/31/2025 | FujifilmFUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) today announced that the company has appointed Brian O’Donnelly as its Corporate Vice President, strengthening global leadership to drive growth in the Electronic Materials Business.
Semiconductors Get Magnetic Boost with New Method from UCLA Researchers
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Creating a Design Constraint Strategy
07/24/2025 | I-Connect007 Editorial TeamMost designers learn how to set their design constraints through trial and error. EDA vendors’ guidelines explain how to use their particular tools’ constraints, and IPC standards offer a roadmap, but PCB designers usually develop their own unique styles for setting constraints. Is there a set of best practices for setting constraints? That’s what I asked Global Electronics Association design instructor Kris Moyer, who covers design constraints in his classes.
Meet the Author: Beth Turner Explores Encapsulating Sustainability for Electronics
07/28/2025 | I-Connect007In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.