American Made Advocacy: Member Profile on Hari Pillai
Happy’s Tech Talk #24: Performance and Registration—Coupons to the Rescue
It’s Only Common Sense: A Step-by-Step Guide to Problem-solvingRogers Introduces RO4450T Glass Reinforced Thermoset Multi-Thickness Bondply
August 31, 2020 | Rogers CorporationEstimated reading time: 1 minute
Wireless circuit designers can now enjoy a true breakthrough with Rogers Corporation's RO4450T™ bondply. This product offers designers a spread glass reinforced bonding material in seven thickness options ranging between 0.0025” (0.064mm) and 0.006” (0.152mm), greatly improving flexibility for high multilayer board count designs.
RO4450T glass reinforced thermoset bondplies were developed for wireless circuit designers looking for a better performing and more reliable alternative to FR-4 materials. The thermosetting hydrocarbon ceramic resin system facilitates a high post cure Tg, making these materials an excellent choice for multilayers requiring sequential laminations as fully cured RO4400 bondplys are capable of handling multiple lamination cycles.
In addition, FR-4 compatible bond requirements permit RO4450T bondply and low flow FR-4 bondply to be combined into non-homogeneous multilayer constructions using a single bond cycle. RO4450T bondplys are recognized by Underwriter Laboratories with the UL 94 V-0 flame rating, and are compatible with lead-free processes.
About Rogers Corporation
Rogers Corporation is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, e-Mobility and renewable energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.
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