IPC E-Textiles 2020 Virtual Summit Offers Top-notch Education


Reading time ( words)

The IPC E-Textiles 2020 Virtual Summit, to be held Oct. 1 and 2, is a two-day event consisting of educational workshops, interactive panel discussions, and a tour of the University of Minnesota Wearable Technology Lab. IPC E-Textiles 2020 Virtual Summit is an ideal event for companies actively involved in e-textiles development, such as EMS and OEM companies, or product innovators and materials suppliers investigating how to apply e-textiles technologies to future products.

Registrants get early access
IPC is launching a new online educational community within IPC EDGE for the e-textiles industry and wants IPC E-Textiles 2020 Virtual Summit registrants to be the first to take advantage of this new offering. IPC will send exclusive passes to registrants this month.

The following is the agenda for IPC E-Textiles 2020 Virtual Summit. Workshops will be split into morning and afternoon sessions, and IPC will record all workshops for attendees who can’t attend all four sessions. 

Workshops

October 1:

E-Textiles Products for Consumer and Medical Applications
Speakers: Madison Maxey, LOOMIA; Md. Tahmidul Islam Molla, Cornell University; and Paul J. Wagner, Minnesota Wire

Material Issues and Wash Factors
Speakers: Chuck Kinzel, Liquid Wire; Lauren Cantley, MIT Lincoln Laboratory; and Mary Johnson, P+G Fabric and Air Care

October 2:

E-Textiles for Defense and Government Applications
Speakers: Brian Farrell, Human Systems Integration and Carole Winterhalter, U.S. Army Combat Capabilities Development Command

University of Minnesota Wearable Technology Lab Demonstrations

During this session, students and faculty will provide demonstrations and discussions on recent projects and lab capabilities, as well as a virtual tour of the Wearable Technology Lab.

Registration for IPC E-Textiles 2020 is $120 for IPC members, $150 for nonmembers. Sponsorships are available, starting at $500. For more information about the conference, visit www.ipc.org/E-Textiles-NA or e-mail Chris Jorgensen, IPC director of technology transfer.

Share

Print


Suggested Items

Just Ask Tara Dunn: Will IC Substrates Be Produced in Volume in the U.S.?

12/01/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Tara Dunn’s turn! Tara is the vice president of marketing and business development for Averatek. Today's question: Do you think IC substrates (BGA, CSP, flip chip, etc.) will ever be produced in high volumes in the U.S.?

Just Ask Tara Dunn: DFM for Flex and Rigid-Flex

11/06/2020 | I-Connect007 Editorial Team
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, John Mitchell, and others in our “Just Ask” series. Now, it’s Omni PCB President Tara Dunn’s turn! A regular Flex007 columnist, Tara discusses flexible circuits, rigid-flex, and rigid PCBs, as well as RF/microwave technology, microelectronics, and additive processes. Tara is the co-founder of Geek-a-Palooza and a show manager for the SMTA Additive Electronics TechXchange event. She has over 20 years of experience in the PCB industry. We hope you enjoy “Just Ask Tara.”

Flex on the Brain: The Future of Neural Interfaces

10/26/2020 | Andy Shaughnessy, Design007 Magazine
The SMTA Additive Electronics TechXchange took place virtually on October 14, with presentations from a wide variety of technologists involved in additive processes. Andy Shaughnessy describes how one of the highlights was a presentation titled “Flexible Electronics for Neural Interfaces” by Dr. Jonathan Viventi, assistant professor of biomedical engineering at Duke University.



Copyright © 2021 I-Connect007. All rights reserved.