Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

Myrias Optics Secures $2.1M Seed Funding to Advance Wafer-Level Metaoptics

02/25/2026 | PRNewswire
Myrias Optics, a world leader in wafer-level metaoptics and diffractive optical technologies, announced the closing of a $2.1 million Seed 1 financing round in January 2026.

TTCI Brings Real-World Test Engineering to the 2026 APEX EXPO

02/17/2026 | TTCI
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, will exhibit at the 2026 APEX EXPO, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California.

From Aspiration to Acceleration: How IEMI Reflects India’s Electronics Growth

02/17/2026 | Sanjay Huprikar, Chief Global Officer, Global Electronics Association
In 2022, the Global Electronics Association’s team in India launched Integrated Electronics Manufacturing & Interconnections (IEMI) as a humble yet aspirational vision for India to become a vital community connector between global supply chains and regional electronics manufacturing ecosystems. Fast forward to January 2026, and a lot has certainly happened in the macro-sense within four lightning quick years. Against this immense backdrop of progress, the fourth edition of IEMI, held in Bangalore on Jan. 29–30, was attended by 1,600 delegates, including 100 from 15 countries outside India representing Asia, Europe, Africa, North America, and Australia. 

EIPC Winter Conference Review: A Focus on Miniaturization

02/12/2026 | Pete Starkey, I-Connect007
The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

Driving Innovation: People Driving Precision in PCB Processes

02/03/2026 | Simon Khesin -- Column: Driving Innovation
The technology behind PCB production is both complex and fascinating. It represents a precise mix of different technologies and disciplines—mechanical, optical, and chemical—all working in concert. Yet, people are the most vital component in perfecting these solutions. I’d like to share how the specialized roles at Schmoll Maschinen GmbH in Germany contribute to the company’s commitment to excellence.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in