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DELO Launches Liquid Pressure-sensitive AdhesivesNovember 5, 2020 | Delo Industrial Adhesives
Estimated reading time: 2 minutes
DELO has developed adhesives that have similar properties to (double-sided) adhesive tapes but are applied in liquid form. This helps users save time and costs in the production process. The liquid pressure-sensitive adhesives can be dispensed accurately and once the components have been joined, they can be further processed immediately in a fully automated process. The adhesives are particularly suitable for electronic applications such as smartphone speakers or display frames.
Adhesive tapes are used for numerous bonding applications in the electronics industry. Their advantage is the immediate adhesion after two components have been pressed together. However, adhesive tapes have two major disadvantages. The first is: When using small or complex tape geometries, automated handling becomes very time-consuming or even impossible due to the low stiffness of the carrier material and the high adhesive force. The second is that structures with a low fill factor, like those found in frame bonding, involve a large amount of waste from cutting the geometric shapes, which increases component costs.
The liquid pressure-sensitive adhesives from DELO now open up new possibilities. They are dispensed in liquid form directly onto the component and then irradiated by UV light. This creates a tacky surface, which is characteristic for tapes. Since the adhesive reaches its initial strength immediately after the second component is pressed on, the bonded assembly can be processed directly and without any fixing devices. This is a great advantage over many standard liquid adhesives.
The entire process, from precise dispensing even on tiny components or three-dimensional geometries to irradiation and mechanical pressing, can be fully automated. This makes the liquid pressure-sensitive adhesives particularly suitable for high-output production.
Depending on the requirements, users can choose liquid pressure-sensitive adhesives with different chemical bases. The acrylate-based adhesive DELO PHOTOBOND PS4130 has very similar properties to typical adhesive tape in terms of flexibility, peel resistance and strength. It is particularly suitable for adhesive applications with short cycle times and moderate requirements on final strength. Thanks to its excellent damping properties and low outgassing values, DELO PHOTOBOND PS4130 is already being used, for example, in the assembly of smartphone speakers.
The epoxy-based adhesive DELO KATIOBOND PS6372, on the other hand, was developed specifically for structural bonding applications requiring high strength. Once the initial strength has been achieved by pressing on the components, the assembly can be processed immediately, with the strength of the bonded joint increasing afterwards. When fully cured, DELO KATIOBOND PS6372 achieves compression shear strengths of over 30 MPa on aluminum and over 10 MPa on FR4. Its high resistance to temperature and media makes it also suitable for automotive applications.
Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of the motivations behind a repair. Dispensing and placing a 400 μm pitch component manually is very time consuming and could cause collateral damage to the already populated components. A novel automatic repair method and tools with no human interaction were developed. Learn about this method…
One of my great joys as a grandfather of eight is spending time with them at the park. It doesn't take too long until I'm getting stuck on a slide that is too small for me or on the seesaw, with me on one side and them trying to lift me. At that point, they learn some harsh lessons in physics and how heavy Grandpa really is. A seesaw is a relatively simple device, but it’s a great way to explain a rather complex concept in PCB design: design tradeoffs. Each decision made throughout a design comes with inherent pros and cons.
IPC’s Kris Moyer teaches design techniques for embedding components, and he’s noticed an upswing in his students’ interest in embedded component design. We recently spoke with him about embedding component design: best practices, pros and cons, and when it makes sense for designers to start embedding.
We’re always hearing about PCB technology running into a wall. On the design side, Moore’s Law hit one such wall. On the fab side, features are now so tiny that the traditional subtractive methods have hit another type of wall. And we see OEMs who never planned to use flexible circuits wind up embracing them, because rigid boards just won’t fit into a new product’s form factor. In the February 2024 issue of Design007 Magazine, our expert contributors lay down the foundation of knowledge that designers need to be aware of to make intelligent, educated decisions about embedded design.
We’re always hearing about PCB technology running into a wall. On the design side, Moore’s Law hit one such wall. On the fab side, features are now so tiny that the traditional subtractive methods have hit another type of wall. Similarly, the popularity of embedded components is the result of technology hitting a wall, or a series of walls. In this month's issue of Design007 Magazine, our expert contributors lay down the foundation of knowledge that designers need to be aware of to make intelligent, educated decisions about embedded design.