-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCertifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
The Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Best Papers from SMTA International Announced
February 5, 2021 | SMTAEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/5316/3155/0765/Contract_Circle.jpg)
The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.
Richard Coyle, Ph.D., Nokia Bell Labs, won the Best of Proceedings category for the paper "Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony." Co-authors include Charmaine Johnson, Dave Hillman, and Tim Pearson, Collins Aerospace; Michael Osterman, CALCE; Joe Smetana, Nokia; Keith Howell, Nihon Superior Co., Ltd.; Hongwen Zhang and Ji Geng, Indium Corp.; Julie Silk, Keysight Technologies; Derek Daily, Senju Comtek Corp.; Babak Arfaei, SUNY-Binghamton; Ranjit Pandher, Alpha Technologies; Andre Delhaise, Celestica; Stuart Longgood, Delphi Technologies; Andre Kleyner, Aptiv.
The following papers received honorable mention:
- Andrew Mawer, NXP Semiconductors, for the paper "Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications." Co-authors include Mollie Benson, Dwight Daniels, A R Nazmus Sakib, and Vishrudh Sriramprasad, NXP Semiconductors N.V.
- Jennifer Bennet, P.E., IBM Corporation, for the paper "CBGA and CCGA Field Reliability Predictions Confirmed." Co-authors include Jim Bielick and Marie Cole, IBM Corporation.
- Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions, for the paper "Advanced SIR Testing for Trapped Solder Paste Flux Residue." Co-authors include Aurkie Ray, Anna Lifton and Paul Salerno, MacDermid Alpha Electronics Solutions.
- Keith Sweatman, Ph.D., Nihon Superior Company, Ltd., for the paper "Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy." Co-authors include Tetsuro Nishimura, Nihon Superior Co., Ltd.; Sergey A. Belyakov and Christopher M. Gourlay, Imperial College London.
The authors will receive their awards during a ceremony at SMTA International 2021. The SMTA International Conference and Exhibition (SMTAI) 2021 will be held November 1-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN, USA. Details on participating in the 2021 SMTA International Conference are posted on the event website: https://smta.org/mpage/smtai-cfa2021
Abstracts of all papers can be browsed directly in the online Knowledge Base. Featuring thousands of full-length technical articles, the SMTA Knowledge Base is searchable to all visitors, but free PDF downloads are available only to SMTA members. Non-members can easily join SMTA for real-time access to the Knowledge Base.
Suggested Items
Altus Highlights Success of Essemtec's I2S in the UK and Ireland Market
07/23/2024 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, is pleased to highlight the success of Essemtec's Integrated Inspection System (I2S).
Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
07/23/2024 | ASMPTASMPT, the market and innovation leader in SMT manufacturing technology, has added two new features to its proven DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2
07/17/2024 | I-Connect007 Editorial TeamIn this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
07/10/2024 | SMTAThe SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.