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Building A Better, Brighter LED Headlamp with Top-Side Alignment Process (TAP)February 10, 2021 | Glenn Farris, Universal Instruments Corp.
Estimated reading time: 1 minute
An emerging trend in the automotive industry is the adoption of advanced LED headlamp lighting systems. These systems drive challenging placement requirements for LED packages. In this paper, we will review these unique challenges and discuss a novel approach to high-accuracy placement of LED packages enabling a scalable production solution.
LED lighting technology for automotive headlamp applications provides improved safety and lighting intelligence. LED automotive headlamps are becoming the standard for even the most affordable automobiles and the automotive LED market is expected to reach $3B by 2022.
LED automotive headlamps and emerging applications like LIDAR are complex, requiring ultra-precise assembly to achieve extreme performance standards. High-accuracy placement and exact LED alignment are essential in building brighter and more adaptive (color, direction, intensity) LED automotive headlamps.
Some of the manufacturing challenges of rapidly and accurately placing LEDs include:
- Requirements for accurate top-side vision correction
- Need for high throughput at 10–25µm accuracy
- Non-standard fiducials
- Need for material, process, and application know-how
The most effective way to achieve this is to utilize a top-side alignment (TAP) process for placement of LEDs.
Top-side alignment process (TAP) ensures an accurate, repeatable, high-speed and economical production solution for the placement of LEDs. The TAP process precisely places and aligns LEDs based on top-side features. A top-side inspection of LED (light-emitting diode) features is performed on a back-lit vacuum nest, followed by a bottom-side inspection of critical features. TAP eliminates the inaccuracies of alternative solutions caused by part movement during a post-inspection (top side only) pick process.
To read this entire paper, which appeared in the January 2021 issue of SMT007 Magazine, click here.
Tower Semiconductor and Tianyi Micro Announce Strategic Cooperation in Development of Next Generation OLED Micro Displays for AR/VR02/27/2024 | Tower Semiconductor
Tower Semiconductor, the leader in high-value analog semiconductor foundry solutions, and Tianyi Micro, a leading provider of micro display driver chips specializing in developing silicon-based micro-OLEDs and micro-LEDs, today announced their strategic cooperation in the development of next-generation OLED micro displays for AR/VR, addressing the growing Chinese and global market needs for advanced AR/VR solutions.
When high school students face an upcoming test, they may experience a mix of dread and excitement, depending on the source material and how well they’ve prepared. Similarly, professionals sitting for a certification exam to test their knowledge of IPC standards may feel a whirlwind of emotions. However, these aren't just any exams; they’re meant for operators, engineers, and managers building the critical infrastructure of our world’s most essential electronics systems.
The challenges of the Corona crisis have further accelerated this trend. Many companies now offer only online events, whether due to time or cost reasons. However, at Rehm Thermal Systems, you have a choice: the provider of thermal systems for various industries offers a variety of short, concise online webinars and complements them with in-depth in-person seminars on various topics.
NEC Corporation (NEC; TSE: 6701) has confirmed that its User Plane Function (UPF) for processing user data traffic in 5G core networks (5GC) has achieved an industry-leading throughput of 1.3Tbps per server on Intel servers with 4th generation Intel Xeon Scalable processors.
Cadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs.