Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Wolfspeed Signs Multiyear SiC Agreement for EVs

10/30/2026 | Wolfspeed
Wolfspeed, Inc., a global leader in silicon carbide technology, announced a multiyear supply agreement for Wolfspeed silicon carbide devices to support BorgWarner’s next-generation 800V silicon carbide-based inverter platform as strategic partner.

Purdue, GlobalFoundries Expand Partnership with Master Research Agreement

10/29/2026 | Purdue University
Purdue University has announced a master research agreement (MRA) with GlobalFoundries (GF), a leading manufacturer of essential semiconductors, significantly expanding the university’s research capabilities and bolstering the talent pipeline in the semiconductor ecosystem.

Neways, SRC Partner on Advanced European Defense Technology

10/20/2026 | Neways
Neways, the global innovator in mission-critical technology for leading semicon, defense & mobility, and connectivity companies, has signed an agreement with SRC, Inc., a not-for-profit U.S. research and development corporation specializing in developing, manufacturing and servicing advanced defense technologies.

Wolfspeed Secures Conditional $1.5B U.S. Defense Loan Commitment

10/14/2026 | Wolfspeed
Wolfspeed, Inc. announced it has received a conditional loan commitment letter from the U.S. Department of War (DoW), through its Office of Strategic Capital (OSC), for up to $1.5 billion of long-term financing to support the domestic development and production of silicon carbide (SiC) materials and wide bandgap power devices, with an additional focus on U.S. national security applications.

GlobalFoundries, TSMC Agree on U.S. Silicon Interposer Supply for AI Packaging

10/12/2026 | GlobalFoundries
GlobalFoundries (GF) announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in