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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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IPC Issues Call for Participation for IPC APEX EXPO 2022
April 8, 2021 | IPCEstimated reading time: 1 minute

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2022 to be held at the San Diego Convention Center. Professional development courses will take place January 23, 24 and 27, 2022 and the technical conference will take place January 25–27, 2022.
The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best Paper."
Expert papers and presentations are being sought in the following areas: factory of the future implementation; circuit design and component technologies; quality, reliability, test and inspection; enabling future technologies; meeting extreme environments; electronics materials; conscientious engineering; assembly processes; and PCB fabrication and materials. For specific topics under each area, visit www.ipcapexexpo.org/CFP.
An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.
In addition, course proposals are solicited from individuals interested in presenting half-day (three-hour) professional development courses on design, manufacturing processes and materials.
Technical conference paper abstracts are due June 18, 2021. Professional development course proposals are due July 16, 2021. To submit an abstract or course proposal, visit www.IPCAPEXEXPO.org/CFP.
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