Elbit Systems to Equip Multinational MRTT Fleet with J-MUSIC DIRCM System
April 13, 2021 | Elbit SystemsEstimated reading time: 1 minute

Elbit Systems will supply an additional J- MUSIC™ DIRCM (Direct Infrared Countermeasures) self-protection system to the Multinational Multi-Role Tanker Transport Fleet (MMF). This time for the ninth Airbus A330 MRTT aircraft, the last addition of the fleet, to be equipped with Elbit Systems’ J-MUSIC DIRCM system.
Integrating the Company’s Infra-Red-based Passive Airborne Warning Systems (PAWS IR), the J-MUSIC DIRCM systems that are being delivered to the NATO Support and Procurement Agency (NSPA) are designed in open architecture, integrating the latest laser technology together with a high frame-rate thermal camera and a small, dynamic high-speed sealed-mirror turret thus delivering high performance defense against Infra-Red missile threats.
The MMF program is a multinational pooling and sharing initiative. The fleet will consist of nine Multi-role tanker transport aircraft able to provide strategic transport, air-to-air refueling and medical evacuation capabilities to its six participating nations (Belgium, the Czech Republic, Germany, Luxembourg, The Netherlands and Norway). The aircraft are owned by NATO and managed by the NATO Support and Procurement Agency (NSPA) with the support of the Organization for Joint Armament Cooperation (OCCAR) on the acquisition phase until the end of 2022. The Multinational Multirole Tanker Transport Unit operates the fleet.
Having accumulated more than 300,000 operational flight hours and tested in live fire, Elbit Systems’ family of DIRCM systems are in use by a range of customers onboard more than 25 aircraft types, among them Boeings B747, B737, B757, B767, B777; Airbus A320, A330, A340, A400; Lockheed Martin C130J; Alenia C27J; Leonardo CSAR AW101; EMBRAER KC-390, Gulfstream 650 and more.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).