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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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New Desmear Line from TSK Schill GmbH in Operation at Hofstetter PCB AG
April 19, 2021 | TSK Schill GmbHEstimated reading time: Less than a minute

TSK supplies its long-standing and highly valued customer with a new horizontal chemical wet process machine.
TSK Schill GmbH continues to make progress in wet process machine engineering. Their long-time customer Hofstetter PCB AG in Switzerland invests in a new Desmear line, after the old line had now unfortunately become outdated. The exceptionally good cooperation between Hofstetter and TSK made the project a success, and now that commissioning has been completed, the customer is ready for the future.
"We are very proud to have implemented a very important project with the new Desmear line for Hofstetter PCB in this time and are looking forward to support also in future requests," says Sales Manager Marc Aicheler.
Suggested Items
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
Smarter Machines Use AOI to Transform PCB Inspections
06/30/2025 | Marcy LaRont, PCB007 MagazineAs automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.