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UHDI Fundamentals: UHDI Applications for Medical Devices

07/03/2024 | Anaya Vardya, American Standard Circuits
Ultra high-density interconnect (UHDI) technology typically refers to advanced printed circuit board (PCB) manufacturing techniques that allow for a higher density of electronic components and interconnections within a smaller area. While not directly related to medical applications on its own, UHDI technology can indirectly benefit various medical devices and equipment by enabling smaller, more compact designs with increased functionality and performance.

RTX's Raytheon to Design Landsat Next Space Instruments

06/14/2024 | RTX
Raytheon, an RTX  business, was awarded a $506 million contract from NASA to design and build the Landsat Next Instrument Suite (LandIS), which includes three next generation space instruments, with an option for an additional instrument.

MKS Instruments Set to Build a Super Center Factory in Malaysia

06/12/2024 | MKS Instruments, Inc.
MKS Instruments, Inc., a global provider of enabling technologies that transform our world, announced that it is set to build a Super Center factory in Penang, Malaysia to support wafer fabrication equipment production in the region and globally.

BAE Systems Selected to Build Ocean Color Instrument for NOAA’s GeoXO Constellation

06/03/2024 | BAE Systems
BAE Systems has been selected to build the Ocean Color Instrument (OCX) for the National Oceanic and Atmospheric Administration’s (NOAA) Geostationary Extended Observations (GeoXO) satellite constellation.

NASA Selects First Lunar Instruments for Artemis Astronaut Deployment

03/27/2024 | NASA
NASA has chosen the first science instruments designed for astronauts to deploy on the surface of the Moon during Artemis III. Once installed near the lunar South Pole, the three instruments will collect valuable scientific data about the lunar environment, the lunar interior, and how to sustain a long-duration human presence on the Moon, which will help prepare NASA to send astronauts to Mars.
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