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Universal Instruments Joins Parent Company Delta to Highlight Comprehensive Semiconductor Solutions at SEMICON Taiwan

08/30/2024 | Universal Instruments
Universal Instruments will join parent company Delta, a global leader in power and thermal management technologies and a world-class provider of industrial automation solutions, on booth S7542 at the SEMICON Taiwan trade show on September 4–6.

Texas Instruments Secures $1.6B in CHIPS Act Funding for Texas and Utah Semiconductor Manufacturing

08/16/2024 | PRNewswire
Texas Instruments (TI) and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms for up to $1.6 billion in proposed direct funding under the CHIPS and Science Act to support three 300mm wafer fabs already under construction in Texas and Utah. In addition, TI expects to receive an estimated $6 billion to $8 billion from the U.S. Department of Treasury's Investment Tax Credit for qualified U.S. manufacturing investments.

ASMPT Wins Exclusive Texas Instruments Supplier Excellence Award for Second Year Running

08/12/2024 | ASMPT
ASMPT Limited, the world’s leading maker of integrated solutions for the manufacture of semiconductors and electronics, was recently honoured with the 2023 Supplier Excellence Award from Texas Instruments (TI) for the second year running.

UHDI Fundamentals: UHDI Applications for Medical Devices

07/03/2024 | Anaya Vardya, American Standard Circuits
Ultra high-density interconnect (UHDI) technology typically refers to advanced printed circuit board (PCB) manufacturing techniques that allow for a higher density of electronic components and interconnections within a smaller area. While not directly related to medical applications on its own, UHDI technology can indirectly benefit various medical devices and equipment by enabling smaller, more compact designs with increased functionality and performance.

RTX's Raytheon to Design Landsat Next Space Instruments

06/14/2024 | RTX
Raytheon, an RTX  business, was awarded a $506 million contract from NASA to design and build the Landsat Next Instrument Suite (LandIS), which includes three next generation space instruments, with an option for an additional instrument.
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