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Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market

06/26/2024 | Indium Corporation
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste

06/14/2024 | Indium Corporation
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Indium Welcomes 13 New Interns Into Award-Winning Program

06/12/2024 | Indium Corporation
Indium Corporation is pleased to welcome 13 new interns into its award-winning summer internship program. Indium Corporation’s internship program is a launch pad for talented college students. It’s a uniqueopportunity to embody the company’s guiding principle of The Indium Way—Respect, Appreciation, and Achievement to offer a real-world business environment to these rising stars—and feeds the company’s future employment pipeline.

Werner H. J. Wagner Appointed as General Manager of Indium Corporation Advanced Materials GmbH

06/11/2024 | Indium Corporation
Indium Corporation, a leading innovator in industrial material solutions, is thrilled to announce the appointment of Werner H. J. Wagner as its new General Manager.

Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM

05/17/2024 | Indium Corporation
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
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