-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCertifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
The Butterfly Effect
The basis of chaos theory is a key concept known as the “butterfly effect.” It’s the idea that a small event in one place creates a cascading set of events elsewhere. So, how is the EMS landscape changing? We’re tracking the concerns and dynamics of this landscape, and there’s a lot to learn.
Coming to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Averatek to Present 'Reliability of Solder Joints on Flexible Aluminum PC Boards' at SMTAI
October 6, 2021 | AveratekEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/4016/9086/8125/Averatek_solder_thumb.jpg)
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored “Reliability of Solder Joints on Flexible Aluminum PC Boards.”
Most surface mount technology has primarily focused on developing products for mounting SMDs onto copper-based rigid or flexible printed circuit boards (Cu-PCBs). Aluminum has several advantages compared to copper: it is less expensive, and has about one-third the density of copper, making Al-PCBs much lighter than Cu-PCBs.
Surface treatment of aluminum includes Electroless Nickel Immersion Gold plating (ENIG), which is extensive wet chemistry, and cost-prohibitive for mass adoption. Conductive adhesives like Anisotropic Conductive Paste (ACP) are an alternative, but result in component-substrate interfaces that are inferior to conventional solders in terms of performance and reliability. An advanced surface treatment technology will be presented to address all of these constraints: a breakthrough pretreatment that allows for soldering to aluminum as easily as to copper - with significant benefits over traditional methods of soldering to aluminum.
Additionally, the presenters will discuss functional aluminum circuits, study of solder-aluminum bond, shear results and SEM/ EDS analysis. They will explain how these mounted assemblies on Al/PET containing various resistors and other components pass the surface insulation resistance test (SIR) as well as temperature cyclic tests between -40° C to 105° C for more than 500 cycles. The solder joints formed are quite strong and in the shear tests, the failure occurs at the Al/PET interface. The solder fillets formed using low temperature solders (138° C melting point) are robust, with minimal voiding as evidenced from X-ray studies and cross-section optical microscopy studies.
Suggested Items
Altus Highlights Success of Essemtec's I2S in the UK and Ireland Market
07/23/2024 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry in the UK and Ireland, is pleased to highlight the success of Essemtec's Integrated Inspection System (I2S).
Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
07/23/2024 | ASMPTASMPT, the market and innovation leader in SMT manufacturing technology, has added two new features to its proven DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
07/19/2024 | AlltematedAlltemated's PLACE-N-BOND™ underfilm passed testing and was implemented in volume production to aid in component retention during the second pass reflow of printed circuit assemblies. This successful testing and implementation occurred in various applications with components such as capacitors, inductors, transformers, connectors, and larger ICs.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2
07/17/2024 | I-Connect007 Editorial TeamIn this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
07/10/2024 | SMTAThe SMTA Heartland Chapter announces the rescheduled date for the High Reliability: Virtual STAR Forum, following the overwhelming success of our May event. Join us on Tuesday, July 30, 2024, for an afternoon of engaging discussions and expert insights into high-reliability manufacturing.