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Connected EV Charging Points in Europe and North America Expected to Reach 36 Million by 2028

07/16/2024 | Berg Insight
Berg Insight just released new findings about the market for electric vehicle charging infrastructure in Europe and North America. The number of connected EV charging points in Europe and North America reached an estimated 7.4 million units in 2023.

Continuous Illegal Use of its Software Products: MVTec Demands Largan to Recognize Intellectual Property

07/02/2024 | MVTec
The company MVTec Software GmbH claims to be harmed in an intellectual property infringement case which started with the initiation of criminal proceedings (criminal indictment) by a prosecutor's office in Taiwan against the company Largan, listed on the Taiwan Stock Exchange under No. 3008, and its employees.

Siemens Debuts Fast, Accurate and Context-aware Electrostatic Discharge Verification Solution Spanning all Phases of IC Design

06/26/2024 | Siemens
Siemens Digital Industries Software announced today a fully automated solution to help integrated circuit (IC) design teams rapidly identify and address Electrostatic Discharge (ESD) issues driven by the growing complexity of today’s next-generation IC designs, regardless of targeted process technology.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics—Chapter 1

06/26/2024 | I-Connect007 Editorial Team
Despite being a widely discussed topic since the advent of Industry 4.0 initiatives, the implementation and utilization of analytics tools by electronics manufacturers has been slow, with an adoption rate significantly lower than anticipated. Most of this stagnation can be attributed to the fact that getting data from the factory floor simply isn’t as straightforward as it should be.

Siemens, Intel Foundry Collaborate to Deliver New Tools Certifications and EMIB/3D-IC Innovation

06/25/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced that its ongoing collaboration with Intel Foundry has established a new Electronic Design Automation (EDA) product certification, as well as an embedded multi-die interconnect bridge (EMIB) enablement breakthrough that can help mutual customers leverage the performance, space and power efficiency advantages of 3D-IC (3D integrated circuit) designs much more quickly.
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