proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring
November 2, 2021 | PRNewswireEstimated reading time: 1 minute

proteanTecs, a leading provider of deep data solutions for advanced electronics, announced that it's Universal Chip Telemetry™ (UCT) monitoring technology now supports TSMC's advanced 3nm process.
The company joined the TSMC IP Alliance Program earlier this year, offering silicon-verified, production-proven solutions in TSMC process technologies down to 5nm. "This announcement marks yet another milestone achieved in our long-term collaboration with TSMC to bring scale and optimization to the industry, with visibility into the 3nm generation of silicon process nodes, from production to lifetime operation. Chip makers, system manufacturers, and service providers gain the assurance they need to bring robust and competitive products to market," commented Evelyn Landman, co-founder and CTO of proteanTecs.
proteanTecs has developed enterprise cloud and edge monitoring software based on deep data. The novel data is generated by on-chip UCT Agents™ (monitoring IPs) that are built for analytics. Customers gain actionable insights with automated feedback deployment, enabling them to maximize profit, ensure supply, and exceed operational growth.
During product bring-up and volume testing, chip and system vendors can optimize power-performance per application, improve performance robustness, optimize and track reliability margins, and significantly shorten time to market.
Once deployed in the field, service providers can be alerted on faults before failures, reduce maintenance costs and RMAs, optimize system performance, and extend product lifetime.
"We are pleased with the results of our long-term partnership with proteanTecs in next-generation design enablement," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "The availability of proteanTecs UCT on TSMC's 3nm technology will help our mutual customers achieve silicon innovations benefiting from the significant power and performance boost of our most advanced process technology and quickly launch their new product innovations to market."
Designed for analytics, proteanTecs' UCT Agents are widespread to provide extremely high coverage with negligible PPA (power, performance, area) impact, and operate in test and in mission modes. By extracting data from the Agents and analyzing it in the cloud-based platform using machine learning algorithms, users along the value chain gain:
- Performance and performance degradation monitoring
- Operational, application and environmental monitoring
- Precision profiling and classification
- Interconnect performance monitoring
proteanTecs provides a suite of automated UCT integration tools that perform design assessment, advising on strategic Agent placement for optimal coverage and fusion.
Suggested Items
'TSMC-UTokyo Lab' Launched to Promote Advanced Semiconductor Research, Education and Talent Incubation
06/12/2025 | TSMCThe University of Tokyo (UTokyo) and TSMC announced the opening of the “TSMC-UTokyo Lab”, dedicated to advancing semiconductor research, education and talent incubation.
Facing the Future: Investing in R&D to Stay Competitive
06/10/2025 | Prashant Patel -- Column: Facing the FutureIn the PCB industry, staying ahead of the competition requires more than production efficiency; it demands continuous innovation, a firm commitment to research and development (R&D), and a proactive approach to emerging technologies. Companies that invest in R&D are better positioned to develop advanced solutions, enhance product reliability, and adapt to the dynamic demands of the electronics industry.
Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow
06/06/2025 | BUSINESS WIREKeysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.
Commerce Secretary Howard Lutnick Visits TSMC Arizona Fabrication Facility for Third Fab Ground Breaking
05/02/2025 | U.S. Department of CommerceU.S. Secretary of Commerce Howard Lutnick visited the Taiwan Semiconductor Manufacturing Company (TSMC) semiconductor fabrication facility in Phoenix, Arizona where the company broke ground on a third fab facility.
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.