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Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation

04/25/2025 | Siemens
Siemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.

Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions

04/24/2025 | PRNewswire
Through continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,

TSMC Commits to Ambitious Carbon Reduction Path in Line with Science Based Targets Initiative

04/23/2025 | TSMC
TSMC marked Earth Day by announcing its commitment to the Science Based Targets Initiative (SBTi,) underscoring its dedication to addressing the pressing challenges of climate change. In line with SBTi, TSMC is collaborating with partners to achieve its environmental sustainability goals, embarking on an ambitious and comprehensive carbon reduction path encompassing direct, indirect and value chain emissions.

Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs

04/03/2025 | PRNewswire
Ansys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.

TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity

03/13/2025 | TSMC
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
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