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GÖPEL electronic's SCANFLEX II Controller Now Also Available as PXIeNovember 18, 2021 | GÖPEL electronic
Estimated reading time: 1 minute
Boundary Scan Controllers serve as the interface between the test PC/software and the target assembly in manufacturing or development. Based on state-of-the-art FPGA, SCANFLEX II controllers enable the application of powerful test and validation methods. They use instruments embedded in the electronic assemblies under test with reduced physical access to test and program them. In this context, the SFX II PXIe C4/FXT offers a unified control platform with 4 independent, true parallel Test Access Ports (TAP) for up to 100MHz. This enables the synchronised execution of embedded test, debug and programming operations via boundary scan (IEEE1149.x), processor emulation, chip integrated instruments or the embedded diagnostics procedure. Basic elements include a programmable, multifunctional 32-channel I/O mixed-signal unit with signal frequencies up to 100MHz, programmable TAP protocols for a variety of processor debug interfaces. The SFX II PXIe C4/FXT is controlled via a PXI Express x2 interface.
Due to its multifunctional architecture, the SFX II PXIe C4/FXT offers almost unlimited possibilities to combine all technologies, including mixed signal tests, flexibly and with highest performance on only one platform. This solution approach not only offers the advantage of significantly improved test depth for complex boards even without the use of needles, but it also minimises the number of necessary instruments. For example, embedded functional tests can be used to detect and diagnose dynamic faults, while the features for in-system programming (ISP) for flash components, micro-controllers and PLD/FPGA make other stand-alone programmers superfluous.
Thanks to a multitude of special extension and configuration features, the SFX II PXIe C4/FXT is also already equipped for future embedded technologies for testing, validation, debugging and programming. Using the PXI Express platform, external function tests can thus be easily combined with embedded procedures. The system is suitable for both development and production. As a result, it can be used for prototype design verification, hardware debugging, Flash programming, gang testing of high-volume units and diagnosing defective assemblies from the field to obtain the necessary repair information.
The iNEMI Connector Reliability Test Recommendations Project, Phases 1 through 3, addressed the need for a standardized reliability evaluation method for connectors.
Gardien Group is pleased to announce the installation of the Automated G90L Flying Probe Tester at Alpha Circuit Corp.
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status.
IEC confirms that the atg Luther & Maelzer A7Pro, eight-head, double-sided, high-speed flying probe test system has been ordered and installed at a prominent PCB manufacturer in Toronto, Canada.
In an interview at DesignCon, Gregory Miczek, global applications manager with RoBAT, discussed the company’s background and its expansion path from backplane defect analyzers to TDR testers for high-tech bare and assembled boards.