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EIPC to Hold Technical Snapshot Webinar on November 24
November 18, 2021 | EIPCEstimated reading time: Less than a minute

EIPC will be holding a live technical webinar featuring Daniel Schulze of Dyconex, Lars Böttcher of Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM, and Michael Schleicher of Semikron Elektronik GmbH.
To be held on November 24, 2021, the webinar will tackle advanced high-density packaging substrates for RF and miniaturization, high-density substrate technologies for fan-out and panel-level packaging, and disruptive approach in the design and tool chain of additively manufactured circuit boards.
For more information or to register, contact eipc@eipc.org.
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Rigid-flex Design Guidelines
09/27/2023 | Cherie Litson, CID+, Litson1 ConsultingRigid-flex circuits are unique structures; part rigid board and part flex, they’re increasingly working their way into many of the electronic devices we use every day. There have been many advances in rigid-flex lately as more companies find themselves exploring this technology. So, before I started writing this article about rigid-flex design, I double-checked a few things. Fortunately, there is plenty of rigid-flex information available on a variety of great websites that we all know and trust.