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Advanced Electronics Packaging Digest

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Amkor Technology, NVIDIA Expand AI Infrastructure Partnership

10/21/2026 | BUSINESS WIRE
Amkor Technology, Inc., a leading provider of outsourced semiconductor packaging and test services, announced additional investments in South Korea for capacity expansion initiatives with NVIDIA.

Hitachi Energy, Ansaldo Energia Partner on Integrated Power Solutions

10/19/2026 | Hitachi Energy
Hitachi Energy and Ansaldo Energia signed a Memorandum of Understanding to develop and market integrated power solutions designed to help customers secure reliable power faster and meet rapidly growing electricity needs with greater flexibility, resilience and speed.

TP-Link, Key Tronic Plan US Router Assembly

10/19/2026 | BUSINESS WIRE
TP-Link Systems Inc., a global leader in networking and smart home solutions, announced that it has entered into a Letter of Intent (LOI) with Key Tronic Corp., a premier U.S.-based electronics manufacturer, to bring next-generation product assembly to the United States.

MacDermid Alpha Shares Advanced Metallization Expertise at IMPACT and TPCA Show 2026

10/15/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, will present four technical papers at the IMPACT Conference 2026 and two additional presentations at the Tech X Total Solutions forum during the TPCA Show in Taipei.

Siemens Advances AI Chip Lithography with NVIDIA cuLitho

10/15/2026 | Siemens
Siemens announced significant advances in its collaboration with NVIDIA to accelerate computational lithography workflows.
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