Dan’s Biz Bookshelf: ‘Costovation: Innovation That Gives Your Customers Exactly What They Want—And Nothing More’
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
It’s Only Common Sense: Dear Santa, Here’s My Sales Wish List
Isola Materials Support Military LEO Satellites
December 7, 2021 | IsolaEstimated reading time: 1 minute
Isola Group, a global innovator in materials for printed circuit boards (PCBs), has announced its low-loss I-Tera® MT40 circuit materials supporting multilayer printed circuit boards (PCBs) for military- and commercial-grade low-Earth-orbit (LEO) satellites. The laminates and prepreg materials are suitable for high-density-interconnect (HDI) multilayer assemblies that must meet demanding military size, weight, and power (SWaP) requirements for LEO satellite payloads. The circuit materials are available in the form of I-Tera MT40 laminates and prepreg materials for high-speed-digital (HSD) circuit applications and I-Tera MT40 (RF/MW) laminates for high-frequency RF and microwave (MW) circuits through W-band frequencies.
Straightforward processing methods and manufacturing steps are used to fabricate single-, dual-, and multilayer circuits as well as HDI builds with I-TERA MT40 circuit materials in contrast to the complex and lengthy PCB fabrication processes required with other commonly used high-speed/high-frequency circuit materials such as PTFE. The ease of manufacturing reduces wear on machine tools, fabrication time, and assembly costs.
I-TERA MT40 (RF/MW) laminates maintain a dielectric constant (Dk) of 3.38, 3.45, 3.60, and 3.75 in the z-axis (thickness). The Dk remains stable over a wide temperature range, from -40 to +140°C. The laminates feature low loss at high frequencies, with a dissipation factor (Df) as low as 0.0028. They do not require any special thruhole treatments when forming multilayer circuits and HDIs, and support both HSD, RF/MW, and hybrid mixed-signal circuits. Laminates and prepregs are available in standard thicknesses and panel sizes, with standard copper weights of 0.5 to 2.0 oz. (and custom weights), with the light weight and durability required for critical military LEO satellite payloads.
Share on:
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.