The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Standard of Excellence: The Role of Technology in Enhancing the Customer Experience
Indium Introduces Indalloy 291 Supplemental Bar Alloys
January 6, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy 291 wave solder pots designed to maintain recommended solder pot specifications.
The supplemental bar and bar chips are added to Indalloy®291-containing solder pots that have fallen below or have elevated above the recommended specifications. This can be determined by solder analysis performed by Indium Corporation.
During wave soldering, when the molten solder contacts the air and manufacturing environment, a chunky layer of metal collects on the smooth surface of the molten solder—solder dross. Indium Corporation’s Dross Reduction Bar aids in the reduction of this solder dross build-up within Indalloy®291 solder pots. By reducing dross formation, the Dross Reduction Bar also reduces the amount of solderable metal lost in the solder pot, providing the user a considerable cost-savings over time.
If instead during wave soldering the molten solder contacts a copper-containing PCB, such as an OSP board, the copper from the board can be pulled into the solder wave, increasing
the solder pot’s copper content to an undesirable level. As copper levels gradually rise to become out-of-spec within an Indalloy®291 solder pot, adverse effects to wetting performance and solder joint aesthetics can become more perceptible. Indium Corporation’s Replenisher Bar is used to bring the copper levels back within the recommended solder pot specifications.
Indium Corporation also offers a solder and solder dross recycle program to complete the usage cycle for bar solder. Up to 50% of bar solder used in wave soldering will be converted to dross, which still contains mostly usable metal. Indium Corporation can recycle these materials and return the metal value to you as a credit, or convert them to a usable bar for a fee. During an alloy switchover, use Indium Corporation’s recycling service to reclaim value on the pot dump and leftover bar.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Dr. Ronald C. Lasky. You can also view other titles in our full I-007e Book library here.
Share on:
Suggested Items
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.