Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
Trouble in Your Tank: Can You Drill the Perfect Hole?
Call-for-Participation Webinar: iNEMI Electromigration of SnBi Solder for Second-Level Interconnect Project
January 7, 2022 | iNEMIEstimated reading time: 1 minute
The low melting temperature of SnBi alloys (138°C) makes them attractive for assembling thermally warpage-prone high-density microelectronic packaging. However, Bi has a high propensity for electromigration and segregation at the anode under high current density conditions. This can lead to potentially brittle solder joints with high electrical resistance over time in the field. There is a need to mitigate this shortcoming and develop SnBi solder joints that maintain their performance and reliability over the product life. This iNEMI project will explore the potential to reduce electromigration in low-height solder joints by taking advantage of mechanical and/or chemical back stresses.
Objective
The overall project objective is to determine the boundaries of the envelope formed by joint height, temperature, current density and PCB finishes within which the solder joint will operate reliably over the product life.
The project has multiple phases planned. The first phase will:
- Establish an appropriate test vehicle for electromigration study of solder joints, including a convenient means of achieving various joint heights.
- Investigate the role of back pressure in reducing electromigration in eutectic SnBi solder joints by determining the rate of electromigration of SnBi solder joints with and without diffusion barriers as a function of current density, temperature and joint height.
The Electromigration of SnBi Solder for Second-Level Interconnect project is open for sign-up until January 31, 2022. Two call-for-participation webinar sessions are scheduled to introduce the project. These webinars are open to industry; advance registration is required.
Registration
Tuesday, January 11, 2022
10:00-11:00 a.m. EST (Americas)
3:00-4:00 p.m. CET (Europe)
11:00-12:00 p.m. CST (China)
Register for this webinar
Thursday, January 13, 2022
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (Americas) on January 12
Register for this webinar
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.