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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 21, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Next week, we’ll be in San Diego. In fact, I fly down tomorrow morning to start preparations, along with most of the I-Connect007 team. The weather forecast says to expect sunny, with the occasional cloud, all week, with daytime temperatures around 70 degrees. That’ll be nice, as I’m sure COVID-related social distancing guidelines will encourage us to socialize outside as much as is feasible.
Don’t get me wrong, the team is very excited to be covering the IPC APEX EXPO week in-person. We’ll be practicing our exposure minimization and proper social distancing as best as we can, however. We will also be covering the virtual AltiumLive event, which overlaps with IPC APEX EXPO. Expect to see Andy Shaughnessy and other I-Connect007 faces reporting on both events next week.
Andy and I have been creating these must-read lists since June of 2020, five months after the last in-person IPC APEX EXPO—yes, it’s been that long! So, this is the first of our five must-reads covering the lead-up week to a physical show. No surprise then that reader interest has been somewhat APEX- and AltiumLive-centric this week. Here are the top five standouts from a busy, busy week of news.
Best Technical Papers at IPC APEX EXPO 2022 Selected
Published January 14
In the article, IPC Chief Technologist, Matt Kelly, says, ““The [Technical Program Committee] is absolutely focused on providing highest quality content to the technical conference. This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners." Click through to see who those award recipients are.
Booming Semiconductors: AT&S Shaping Coming Data Revolution
Published January 17
This news piece updates readers on what AT&S presented for latest latest developments in the field of IC substrates at the Consumer Electronics Show CES in Las Vegas. Substrates are key to the semiconductor chips that get placed on the printed circuit boards; keeping up on the latest in semiconductor substrates just makes sense.
Real Time with… IPC APEX EXPO: Siemens’ Supply Chain Solutions
Published January 17
I-Connect007 speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges.
Mycronic to Demonstrate Enhanced Process Control Solutions for Flexible PCB Assembly at IPC APEX EXPO
Published January 19, 2022
From the press release, “Mycronic will continue to demonstrate the benefits of the flexible factory at IPC APEX EXPO in San Diego, January 25-27, 2022. In addition to the latest in integrated SMT assembly solutions, advanced jet printing technology, dispensing and material handling solutions, the company will highlight recent advances in 3D inspection technologies, process analysis tools and process control software.” Click through to read more.
MacDermid Alpha’s Electrolube to Present Two Keynotes on Resins and Coatings at IPC APEX EXPO
Published January 20
Phil Kinner, global business and technical director for Electrolube’s Coatings Division, and Beth Turner, Electrolube’s senior technical manager, will both present papers at the event. Kinner’s is titled “Conformal Coatings: State of the Industry Versus State of the Art,” and Turner’s is titled “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment.” Click through for more details.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
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