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Calumet Electronics Receives ‘World-class Team’ Award from Northrop Grumman
February 2, 2022 | Calumet ElectronicsEstimated reading time: 1 minute
Calumet Electronics Corporation received a World-class Team award from Northrop Grumman Corporation for its outstanding performance. Calumet is one of just 24 small business suppliers across the nation to receive the award and the only recipient from Michigan.
The award recognizes companies that have demonstrated exceptional support and commitment to Northrop Grumman’s business objectives through “delivery performance, outstanding program support, superior technical achievement, and cost performance/competitiveness and continuous process improvement.”
Calumet Electronics’ CEO Stephen Vairo said, “We’re grateful for Northrop Grumman’s ongoing commitment to supporting a diverse array of small businesses and honored to receive recognition as a World-class Team. Northrop Grumman has been a key partner for us as we focus on delivering next-gen technologies and helping solve the industry’s supply issues. Together we are strengthening American electronics.”
This year marks the 30th year Northrop Grumman recognized suppliers with World-class Team awards for supporting its supplier diversity program. The company’s supplier diversity program strives to ensure that capable small businesses receive maximum practicable subcontracting opportunities on all major programs. These small businesses include disadvantaged, women-owned, veteran-owned, and service-disabled veteran-owned, HUBZone small businesses, disability-owned, AbilityOne organizations, LGBTQ+ businesses, and Historically Black Colleges/Universities and Minority Institutions.
Calumet Electronics is America’s only HUBZone-certified PCB manufacturer. The company is 100% owned and controlled by U.S. citizens. The principal offices and manufacturing campus are located in rural Upper Michigan near Lake Superior, Michigan, USA.
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Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.