Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
NextFlex Launches $11.5 Million Funding Round for Flexible Hybrid Electronics Innovations
February 24, 2022 | Business WireEstimated reading time: 2 minutes
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, released Project Call 7.0 (PC 7.0), the latest call for proposals that seek to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing while supporting Department of Defense priorities. The total PC 7.0 project value is expected to exceed $11.5M (project value/investment figures include cost-sharing), bringing the total anticipated investment in advancing FHE since NextFlex’s formation to $128M.
Building from the success and maturity of past Project Calls, PC 7.0 continues the use of broadly defined topics to enable a diverse proposer base, with special emphasis on areas in which FHE can impact high priority U.S. manufacturing opportunities and areas of emerging importance within the FHE community. Areas of emphasis include FHE enabled manufacturing for automotive applications, additive approaches to FHE device fabrication, applying hybrid electronic manufacturing to applications in advanced packaging, and exploring how FHE manufacturing can support improved environmental sustainability in electronics manufacturing.
“We are delighted to announce this new round of funding for advanced manufacturing developments in the US,” said Malcolm Thompson, PhD, Executive Director of NextFlex. “The benefits of FHE – additively manufactured electronic systems that are lightweight, thin, and conformable, are transforming our perceptions of how ubiquitous electronics can truly be. With each successive project call, the NextFlex member community moves the technology closer to commercialization and wide adoption.”
Project proposals should include a plan for transitioning projects to the U.S. industrial manufacturing base while focusing on manufacturing challenges in these topic areas:
- Manufacturing of FHE-Enabled Automotive Components
- Advanced Packaging Approaches for IC Integration in FHE Devices
- Additively Manufactured Electronic Components and Devices
- Improved Environmental Sustainability of Electronics with FHE Manufacturing
- Manufacturing of Soft and Stretchable Electronics
- Enhanced Dielectric Materials & Manufacturing Methods for FHE Devices
- Wearable Human Monitoring / Interface Demonstrator
- Open Topic for “New Project Leads”
In addition, NextFlex announces the release of its FHE Technology Roadmaps. Developed by subject matter experts from industry, academia and government, the NextFlex Technical Working Groups in 11 technical areas of emphasis – Automotive; Device Integration & Packaging; Materials; Modeling & Design; Printed Components & Microfluidics; Standards, Test & Reliability; Asset Monitoring Systems; Flexible Power; Human Monitoring Systems; Integrated Antenna Arrays; and Soft Wearable Robotics – update the roadmaps each year. This is the first time, however, that a public version of the roadmaps is being made available. The roadmaps contain detailed information on the current state of the art, market opportunities and needs, key stakeholders, a five-year forward-looking development roadmap, and prioritized technical gaps identified by each Technical Working Group. These roadmaps inform the priorities for NextFlex Project Calls.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
October EMS Trends Show Stabilizing Market and Building Momentum for 2026
11/28/2025 | Global Electronics AssociationThe Global Electronics Association announced the October 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
Kitron Registers New Share Capital Following Private Placement
11/28/2025 | KitronReference is made to the stock exchange announcement made by Kitron ASA on 25 November 2025 regarding the allocation of 17,000,000 new ordinary shares in the Company at a subscription price of 57.25 per share in the private placement.
Key Tronic Earns Bronze ‘Partner2Win’ Medallion from BAE Systems
11/27/2025 | Key Tronic Corp.Key Tronic Corporation received a Bronze Medallion at BAE Systems’ ‘Partner2Win’ suppler symposium, recognizing its exceptional performance and commitment to operational excellence this year.
Elbit Systems Reports Q3 2025 Results
11/27/2025 | PRNewswireRevenues in the third quarter of 2025 were $1,921.6 million, as compared to $1,717.5 million in the third quarter of 2024.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/28/2025 | Nolan Johnson, I-Connect007Yesterday was the U.S. Thanksgiving holiday. The traditional meal is, of course, roast turkey with “all the trimmings.” Although not everyone observes that menu, most do, and it was reported that 42 million turkeys were consumed on that day. With an average weight of 16 pounds per turkey, we cooked up 672 million pounds! With approximately 342 million people in the U.S, that pencils out to just under two pounds of drumstick and white meat per person. That, my friends, is a whole lot of leftovers.