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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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March 2022 Issue of PCB007 Magazine Available Now
March 15, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In the March issue of PCB007 Magazine, we dish on the materials research and development efforts to meet the ever-tightening relationship between the product’s application and the material selected to serve as the PCB substrate. Now more than ever, material performance, availability and pricing are key factors in the specification of materials in the design phase.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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