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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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March 2022 Issue of PCB007 Magazine Available Now
March 15, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In the March issue of PCB007 Magazine, we dish on the materials research and development efforts to meet the ever-tightening relationship between the product’s application and the material selected to serve as the PCB substrate. Now more than ever, material performance, availability and pricing are key factors in the specification of materials in the design phase.
Preview or download your PDF copy today on the virtual newsstand or subscribe here for delivery in your e-mailbox.
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Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
Cadence, NVIDIA Expand AI & Accelerated Computing Partnership
04/17/2026 | Cadence Design Systems, Inc.At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRETeradyne, Inc., a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry.
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.