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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Nordson EFD to Preview New Dispensing Technologies for Medical Device Assembly at COMPAMED 2026

11/06/2026 | Nordson
Nordson EFD, a Nordson company, announced that trade show attendees will get the first look at two new dispensing technologies, the Ultimus AccuFlow™ and PICO Pµlse® XP HV, at COMPAMED 2026, November 16–19 at the Düsseldorf Exhibition Centre in Düsseldorf, Germany.

When Does Reducing Silver Make Sense?

10/27/2026 | Senthil Kanagavel, MacDermid Alpha Electronics Solutions
There is a single decision at the center of every die-attach conversation right now that isn’t as much about chemistry as it is about control. This is most evident because silver prices have experienced significant volatility, evolving PFAS requirements are increasing regulatory and customer scrutiny, qualification windows are shrinking, and the packages that support AI, automotive, and power infrastructure must meet demanding performance and reliability requirements.

GlobalFoundries Unveils FD-SOI Platform for Physical AI

10/13/2026 | GlobalFoundries
GlobalFoundries (GF) unveiled plans for its new FDX Fusion™ FD-SOI platform, purpose-built for the evolving requirements of Physical AI.

Global Sales of Professional Service Robots Surge 24%

09/30/2026 | IFR
Global shipments of professional service robots increased by 24% to almost 250,000 units in 2025, highlighting a successful shift to commercial automation.

Nordson Electronics Solutions to Showcase Dispensing and Plasma Systems at SEMICON West 2026

09/25/2026 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will feature two new systems designed to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.
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