Sierra Wireless' Next Generation Radio Frequency Optimized 5G Module
April 29, 2022 | Business WireEstimated reading time: 3 minutes
Sierra Wireless, a world leading IoT solutions provider, announced the availability of its next generation 5G mobile broadband embedded modules, the Radio Frequency (RF) optimized EM92 Series. This latest edition to the Sierra Wireless line up will enable the most demanding, business-critical, industrial and networking use cases.
First announced in May of 2021, the EM92 Series 5G modules feature 3GPP Release 16 standard capabilities at a cost-effective price and provide secure connectivity at high speeds with low latency worldwide. The EM92 is ideal for demanding broadband applications such as high definition live video, industrial IoT deployments like machine vision and drones, networking use cases that require reliable broadband communications equivalent to previous wired technologies, and many other new IoT applications.
Being RF-optimized, the modules reduce the complexity of 5G designs and improve global network coverage by supporting more global carrier bands, enabling OEMs, system integrators and other companies to easily integrate 5G connectivity into their products. Customers can make the most of 5G’s high speeds and ultra-low latency while shortening time-to-market, future proofing designs, and ensuring the security of deployment on a worldwide scale.
“For engineers and product managers who want to connect next generation 5G products, the EM92 5G module has been engineered to cater to the most demanding and bandwidth intensive business critical applications,” said Olivier Pauzet, VP of Product & IoT Solutions, Sierra Wireless. “We’ve optimized the RF in this module so that it supports multiple technologies allowing flexibility in design, and even more global carrier bands minimizing SKUs and streamlining logistics to enable the simple, rapid and cost-effective worldwide deployment of next generation 5G IoT applications. It supports both 5G and 4G TDD/FDD networks, with 68 bands for truly global coverage with a single SKU.”
“Sierra Wireless is a trusted partner of DISH,” said Stephen Bye, Chief Commercial Officer, DISH Wireless. “The new 5G EM92 Series modules will feature support for spectrum band N70 and will be the first certified module for use on our 5G network. This partnership will further enable IoT innovation.”
“Sierra Wireless’ 5G modules provide AVIWEST with the fast, low latency and reliable 5G connectivity needed to stream high-definition videos from live worldwide events such as the Olympics, to broadcasters’ production facilities, allowing broadcasters to realize the cost, performance and simplicity of 5G-powered remote production,” said Ronan Poullaouec, CTO at AVIWEST.
EM Series Modules
The EM92 Series of 5G modules aims to make 5G more affordable, while building on the success of the company’s EM91 Series which includes both the EM9190 5G mmWave/Sub-6/LTE New Radio (NR) and EM9191 5G Sub-6/LTE NR standards-based M.2 modules. Both series of modules in Sierra Wireless’ embedded broadband portfolio deliver unprecedented bandwidth and network performance and have been designed to securely connect to 5G networks around the world. Security is designed in at the forefront right from the start of module development to minimize security risks, as well as additional time in certification requirements.
Transforming Industries with 5G
5G’s higher data speeds and capacity, wider coverage, and lower latency are transforming the IoT industry by enabling next-generation computing and edge-to-cloud applications, and enabling the expansion of the mobile ecosystem to new industries such as smart manufacturing, connected healthcare and smart cities.
By 2025, 5G networks are likely to cover one-third of the world’s population and account for as many as 1.2 billion connections according to the GSMA. The impact on the mobile industry and its customers will be profound. It’s no surprise then that the industry is investing heavily in 5G, with mobile operators expected to spend $1.1 trillion worldwide between 2020 and 2025 in mobile CAPEX, roughly 80 per cent of which will be on 5G networks.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
Podcast Episode 2—AI Is Changing the Rules: Are Your PCB Materials Ready?
03/10/2026 | I-Connect007I-Connect007 announces the release of the second episode in its new six-part podcast series, PCB Materials: The Backbone and Future of Electronics. In “5G, AI & Beyond—Designing for High-Speed Performance,” we explore how artificial intelligence is reshaping the rules of electronics design, demanding unprecedented speed, power, and high-frequency performance that push beyond the limits of traditional materials. As AI applications scale rapidly, are yesterday’s materials becoming obsolete?
STMicroelectronics Completes Acquisition of NXP’s MEMS Business
02/03/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, completed the acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business.
Real Time with... productronica 2025: Navigating Changes in the EMEA Market—Insights from Ventec Experts
12/10/2025 | Real Time with...productronicaVentec's Mark Goodwin and Pesh Patel explore the EMEA market's structural changes, including Panasonic's factory closure and its effects on laminators. They discuss the transition to low DK glass and the influence of the AI boom. Mark highlights the need for effective inventory management, while Pesh presents the glass-free revolution, showcasing new materials and resin technologies that improve performance and expand applications beyond traditional circuit boards.
Real Time with... productronica 2025: Enhancing Manufacturing With Conformal Coatings From MacDermid Alpha
12/04/2025 | Real Time with...productronicaSaskia Hogan, global product manager for conformal coatings at MacDermid Alpha Electronics Solutions, discusses the role of coatings in improving manufacturing efficiency and sustainability. She addresses challenges faced by customers, such as harsher environments and cost pressures, while emphasizing the need for high reliability in critical applications.