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AIM to Highlight V9 at SMTA Juarez and Tijuana ExposMay 19, 2022 | AIM
Estimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Juarez and SMTA Tijuana Chapter Expos, taking place on May 19th and May 26th, respectively. AIM will highlight V9, their new ultra-low-voiding, no clean paste, along with their full line of solder assembly materials.
Formulated to solve one of the industry’s most difficult challenges, V9 has proven to reduce voiding to as low as 1% on BGA and <5% on BTC components while exhibiting stable print performance on fine feature devices over 12 hours. V9 post-process residue is easily probed and possesses high SIR values required for high reliability applications.
To discover all of AIM’s products and services, visit the company at the SMTA Juarez Expo on May 19th, and SMTA Tijuana Expo on May 26th, for more information and to speak with one of AIM’s knowledgeable staff members.
Thermaltronics USA, Inc., a globally acclaimed manufacturer of Precision Soldering Robots and innovative Curie point soldering systems, is excited to announce its participation in the highly anticipated SMTA Guadalajara Expo & Tech Forum, scheduled to take place from October 25-26, 2023.
At this year's productronica, the world's leading trade show for electronics manufacturing, ULT will present a brand new extraction solution for solder fumes and vapor.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, component lead tinning and solderability test equipment, announces that it has added assembly and production staff members to its team to accommodate its recent increase in sales and order demand.
SMTA is honored to announce Qais Qasaimeh, a graduate student at Auburn University, has been selected as the winner of the 2023 Charles Hutchins Educational Grant.
SHENMAO America, Inc. is proud to introduce its latest innovation in response to the growing demand for ultra-thin packages in the electronics industry.