The Chemical Connection: Don’t Just Blame the Etcher
It’s Only Common Sense: Doing Business the Elon Musk Way
Nolan's Notes: ConvergenceQualcomm Unveils Next Generation Powerline Communication Device
May 31, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 1 minute
In continued efforts to support the growing electric vehicle (EV) segment, Qualcomm Technologies, Inc. today announced a next-generation powerline communication (PLC) device, the QCA7006AQ, designed to address the needs for electric vehicle (EV) charging station communications – also known as electric vehicle supply equipment (EVSE) – that use global Combined Charging System (CCS). The PLC device is based on Qualcomm Technologies’ market proven QCA700X family of products, which have been widely adopted in EV on-board charging units and charging stations across the globe. The QCA7006AQ is compliant with the HomePlug Green PHY (HPGP) specification, which is the leading specification for implementing Vehicle-to-Grid (V2G) systems.
Smart-grid integration allows vehicles to seamlessly authenticate on the network through Plug and Charge automated payments for EV charging, coordinating the timing and direction of energy to and from the grid and home. Smart-grid charging applications supported by the CCS standard allows users the flexibility to choose optimal charging times and extract energy from their EVs as needed, supporting the growing need for EV charging while minimizing peak load power generation and distribution requirements.
This is Qualcomm Technologies’ first QCA700X PLC device designed to support an Ethernet digital interface and that is qualified to support an ambient operating temperature range of -40°C to +105°C (AEC-Q100 Automotive Grade 2). As an optional feature, the QCA7006AQ also supports HomePlug Audio Video (HPAV) streaming at PHY rate exceeding 200 Mbps, allowing EV customers an alternate wired data connection to the cloud through the charging station. The introduction of the Ethernet digital interface, in addition to Serial Peripheral Interface (SPI), the AEC-Q100 Grade 2 compliance, and the HPAV operation mode, supports expanded design flexibility for future devices.
“By further expanding our PLC device portfolio, in addition to engineering the fully integrated, scalable Snapdragon Digital Chassis solution for automakers, Qualcomm Technologies is supporting an evolving automotive industry driven by the EV vehicle architecture,” said Lars Boeryd, Sr. Director Product Marketing, Automotive at Qualcomm Technologies, Inc. “As a leading supplier of PLC HPGP devices for smart-grid communications, we are committed to helping our customers succeed in a growing EV industry increasingly adopting the CCS standard.”
Share on:
Suggested Items
Pivoting on Substrates
09/27/2023 | I-Connect007 Editorial TeamOved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.
Airbus Unveils PioneerLab as its New Twin-engine Flying Laboratory
09/26/2023 | AirbusDuring the German National Aviation Conference in Hamburg, Airbus Helicopters unveiled the PioneerLab, its new twin-engine technology demonstrator based on the H145 platform.
Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
09/26/2023 | Cadence Design Systems, Inc.Cadence Design Systems, Inc. announced the expansion of its node-to-node design migration flow based on the Cadence® Virtuoso® Studio, which is compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies.
HyRel Technologies Achieves Coveted AS9100 Certification, Elevating Aerospace Excellence
09/25/2023 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, proudly announces that it earned the prestigious AS9100 certification.
Charter and Qualcomm to Deliver Next-Generation Advanced Wi-Fi Router
09/22/2023 | Qualcomm Technologies, Inc.Charter Communications, Inc. and Qualcomm Technologies, Inc., today announced a collaboration to deliver the next-generation Advanced Wi-Fi router that will bring Wi-Fi 7 and 10 Gbps Wi-Fi capabilities to Spectrum Internet users, helping support and enhance the converged connectivity experience for residential and small and medium-sized business customers. Advanced Wi-Fi routers with Wi-Fi 7 are expected to be available to Spectrum customers in 2024.