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Summit Interconnect Welcomes Bobby Johnson as New Vice President of Human Resources

07/19/2024 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced PCB manufacturing, is pleased to announce the appointment of Bobby Johnson as the new Vice President of Human Resources. Johnson brings a proven track record in human resources leadership, making him a valuable addition to the Summit Interconnect team.

Global Citizenship: Bringing Two Cultures Together in PCB Manufacturing

07/17/2024 | Tom Yang -- Column: Global Citizenship
Welcome to my new column. My name is Tom Yang, and I am the CEO of CEE PCB, a family-owned global printed circuit board business. I was actually educated in California, earning my bachelor’s and master’s degrees in finance at Cal State. After graduating, I worked in investment banking for a while, then came to work at CEE, where I have been ever since.

ROCKA Solutions Continues Expansion in Brazil with New Location in Manaus

07/17/2024 | ROCKA Solutions
ROCKA Solutions announced the continued expansion of its operations in Brazil. Having expanded into Brazil earlier this year with a location in São Paulo, the company is pleased to announce an upcoming second location in Manaus.

STARTEAM's Hong Kong and Shenzhen Offices Achieve ISO 27001 Certification

07/08/2024 | STARTEAM GLOBAL
STARTEAM is pleased to announce that its Hong Kong and Shenzhen offices have successfully achieved ISO 27001 certification. This accomplishment follows the certification of its Karlsruhe office in April 2024, ensuring that all primary offices now meet the highest standards of information security.

GlobalFoundries Acquires Tagore Technology’s GaN Technology to Accelerate Disruptive Power Management Solutions

07/02/2024 | GlobalFoundries
GlobalFoundries (GF) announced that it has acquired Tagore Technology’s proprietary and production proven Power Gallium Nitride (GaN) IP portfolio, a high-power density solution designed to push the boundaries of efficiency and performance in a wide range of power applications in automotive, internet of things (IoT) and artificial intelligence (AI) datacenter.
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