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Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record

09/21/2023 | TrendForce
Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase.

indie Semiconductor Acquires EXALOS AG

09/19/2023 | indie Semiconductor
indie Semiconductor, an Autotech solutions innovator, announced it has entered into a definitive agreement and completed the acquisition of privately held EXALOS AG, a Swiss photonics company, specializing in the design of high-performance optical semiconductors.

StratEdge Reveals High-Performance Semiconductor Packages at European Microwave Week, IMAPS International, and IEEE BCICTS

09/19/2023 | StratEdge
StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including European Microwave Week (EuMW), September 19-21, IMAPS International, October 3-4, and IEEE BCICTS, October 16-17.

Matrix Reports Growing Demand for Automated Dry Film Mylar Peeling Equipment

09/18/2023 | Matrix Electronics
This past year Matrix introduced the Advanced Engineering PMA101-CPB Mylar Peeler to the North American market. The PMA101-CPB Mylar Peeler is one of the most successful products in this category with over 200 units sold globally. This latest version of the mylar peeler was released in mid-2022 with a fully enclosed cabinet and upgraded PLC to support growing Industry 4.0 requirements in the PCB fab market. This machine can operate as a standalone unit or be combined with Advanced Engineering SRV automated load, unload equipment to connect to a customer’s DES line.

MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024

09/14/2023 | MediaTek
MediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
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