The Importance of Rigid-Flex PCB Design Guidelines
July 21, 2022 | Cody Stetzel, Cadence Design SystemsEstimated reading time: 2 minutes

I have the tendency to try to replicate the delicacies I’ve ordered at restaurants in my own kitchen. One of my latest attempts at creating restaurant-worthy dishes was a Korean pancake that’s crispy on the outside but soft on the inside. With my amateur cooking skills, it proved to be an impossible task—I could either make only a hard pancake or one that was total fluff.
While I’m still struggling to figure out the trick to bringing together the different textures of a Korean pancake, I’ve had more success in bringing together the hardboard elements and flexible PCB elements of a rigid-flex PCB. Compared to making Korean pancakes, striking the right balance of flexibility and rigidity on a rigid-flex PCB is easy if you abide by rigid-flex PCB design guidelines.
What Is a Rigid-Flex PCB?
For those who have spent their careers designing conventional PCBs on the FR-4 substrate, a rigid-flex PCB may be unfamiliar territory. As the name implies, a rigid-flex PCB is a PCB that combines both elements of a hardboard and a flexible PCB in a single piece.
A rigid-flex design is typically made up of two or more rigid areas that are interconnected by a flexible strip. The synergistic property of the rigid and flex elements allow the PCB to be bent or folded in applications.
Rigid-flex PCBs are getting more attention in recent years, due to the demand for more compact, shock-resistant, and robust electronics. A rigid-flex design eliminates the need for connectors and interconnecting cables. Rigid-flex PCBS are also easier to install, as the entire design is manufactured on a single PCB.
Material Considerations for Rigid-Flex PCB Design
You’ll want to consult your PCB manufacturer before starting a design. Depending on whether the PCB is meant for dynamic bend or stable bend, the choice of copper type, the number of layers, bend radius, and coverlays may differ.
A dynamic bend rigid-flex PCB is installed in an environment where it will constantly be subjected to bending. Therefore, it is recommended to use no more than two layers and ensure that the bending radius is at least 100 times the material thickness.
Meanwhile, it’s possible to have up to 10 to 20 layers for a rigid-flex PCB that’s meant for stable-bend installations. It is not subjected to repeated bending force and that means a smaller bending radius of about 10 times its material thickness is also possible.
To read this article, which appeared in the July 2022 issue of Design007 Magazine, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.
Driving Innovation: Depth Routing Processes—Achieving Unparalleled Precision in Complex PCBs
09/08/2025 | Kurt Palmer -- Column: Driving InnovationIn PCB manufacturing, the demand for increasingly complex and miniaturized designs continually pushes the boundaries of traditional fabrication methods, including depth routing. Success in these applications demands not only on robust machinery but also sophisticated control functions. PCB manufacturers rely on advanced machine features and process methodologies to meet their precise depth routing goals. Here, I’ll explore some crucial functions that empower manufacturers to master complex depth routing challenges.
Trouble in Your Tank: Minimizing Small-via Defects for High-reliability PCBs
08/27/2025 | Michael Carano -- Column: Trouble in Your TankTo quote the comedian Stephen Wright, “If at first you don’t succeed, then skydiving is not for you.” That can be the battle cry when you find that only small-diameter vias are exhibiting voids. Why are small holes more prone to voids than larger vias when processed through electroless copper? There are several reasons.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.