-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Wistron, Purdue University Signed a Cutting-edge Technology Research Plan
August 22, 2022 | WistronEstimated reading time: 2 minutes
Wistron Corporation announced signing a cutting-edge technology research plan with Purdue University. Both will cooperate on open edge computing and smart manufacturing related applications, while jointly developing decentralized processing systems that can be used in smart factory management platforms.
Wistron and Purdue University started cooperation negotiations in 2021. After in-depth discussions on the direction and implementation of the research plan, a consensus was reached in mid-2022, and a master agreement in cooperation was signed afterwards. Wistron and Purdue will formulate substantive research subjects under this framework. Wistron will invest in R&D and talents in the next three years to jointly promote research for the next generation edge computing platform with Purdue University.
Simon Lin, Chairman of Wistron, said: "Wistron always devotes to promoting advanced technology research, and has continuously collaborated with the best global universities, experts, and scholars. This research collaboration with Purdue University shows that Wistron’s continuous growth stems from not only the R&D transformation inside the company but from also working with excellent institutes and talents in and outside Taiwan, making breakthroughs in technologies, accelerating digital transformation, and building technological competitiveness. Through research collaboration, Wistron can expand its reach in the United States, participate in technology alliances, and access the latest information in the industry."
Dr. Mung Chiang (Purdue University President-Elect, formerly John A Edwardson Dean of College of Engineering) is the project director of this cooperation program. He states: " We are excited about the new research collaboration between Purdue and Wistron, one of the largest tech companies in the world on the edge of innovation today. We thank Wistron’s chairman, Simon Lin, for his visionary leadership in making this collaboration a reality. These research projects will accelerate our joint effort in advanced manufacturing, cyber security and edge computing.”
According to Wistron, the results of this research plan will contribute to the development of Wistron's new businesses in the future, and a R&D team will be established by recruiting local professional talents. Furthermore, Wistron will support talents expected to contribute to society as well as technology development by offering scholarships to two or three Taiwanese students studying at Purdue to join the research projects.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Casimir Launches With $12M Seed Round for Quantum Energy Chip
05/12/2026 | BUSINESS WIRECasimir, Inc., a quantum energy technology company founded by former NASA advanced propulsion researcher Dr. Harold “Sonny” White, today announced the close of a $12 million seed round led by Scout Ventures.
HFR Accelerates GPU-Based AI-RAN Development with ETRI
05/11/2026 | PRNewswireHFR, Inc., a leading telecommunications equipment provider, announced that it has launched the full-scale development of 'AI-RAN,' widely considered the core technology for 6G.
Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
05/11/2026 | Cadence Design SystemsCadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications.
Micro LED CPO Optical Transceiver Market to Reach $848M by 2030
05/11/2026 | TrendForceTrendForce’s latest research into the Micro LED industry highlights how generative AI is driving rapid growth in demand for high-speed optical communications.
Altus Announces Return of ‘Factory of the Future’ for 2026
05/11/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced the return of its ‘Factory of the Future’ event for 2026.