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Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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I-Connect007 Editor’s Choice: Five Must-Reads for the WeekOctober 14, 2022 | Nolan Johnson, I-Connect007
Estimated reading time: 2 minutes
I’ve been in Washington, D.C., most of this week, attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this ground-breaking event. If you’re in this industry, advanced packaging will affect you, make no mistake about it.
The upshot is that, as an industry, we’re at an inflection point:
- Semiconductor companies are going to move to advanced packaging whether the PCB manufacturing sector is ready or not
- The emergence of UHDI to support advanced packaging will move HDI to the mainstream
- Advanced packaging capabilities will require significant investment, but is also strategically critical
- IPC has chosen to expand their mission to include advanced packaging
- The distinction between semiconductor and PCB products and processes is graying
Although the symposium was my entire world this past week, it wasn’t the only thing happening. I wasn’t surprised to see you reading about the latest news in military/aerospace, PCB panels, the CHIPS Act implementation, and microvia design.
Microvias Can Be Stacked in Certain Package Densities
Published October 13
We recently spoke with Summit Interconnect’s Gerry Partida about a pretty important discovery that his company made: Microvias can be reliably stacked in certain package densities. Microvia failure has been a big issue for fabricators lately, especially military contractors, but as Gerry explains, microvias don’t have to be staggered every time—as long as you do your homework and simulate.
Boeing-Built SES Satellites Send, Receive First Signals
Published October 7
It was a big week for Boeing, which successfully launched the SES-20 and SES-21 satellites. In the company’s announcement, it said the satellites will allow them to support customers in delivering high-quality sports and entertainment to tens of millions of U.S. households “while delivering on our promise to repurpose spectrum to enable U.S. leadership in 5G.” More and better sports coverage? Now that’s something worth mentioning.
This news item from IPC helped promote the symposium, but the information it contains is still relevant even though the event has concluded. For example, 94% of electronics industry leaders report that improving the performance of semiconductors is increasingly reliant on advanced packaging. And 84% of electronics industry leaders believe government initiatives to bolster the semiconductor supply chain require significant investment in advanced packaging capabilities. It’s encouraging to know that these companies see where PCB manufacturing is headed and are on board with it. I’m really looking forward to writing and reporting more on this fascinating direction for our industry.
Not all sectors of electronic component manufacturing are in go-go mode at the moment. LCD manufacturers are advising that utilization rates could slip to 60%, which TrendForce says is the lowest level in 10 years. Most panel makers have flipped from operating at a profit to operating at a loss in the second half of 2022. Production reduction plans are currently being implemented, according to the report. For us in the PCB design and manufacturing sectors, this is something to keep our eye on.
FKN Systek: Singulating Pre-Scored PCB Panels up to 48” Long
Published October 7
FKN launched the U.S.-made K4000 motorized depanelizer and readers took notice. Given that the start of Q4 in the calendar year is when new equipment is forecast, could it be that panel cutters are on companies’ wishlists this year?
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is thrilled to announce the premier of a new online video series “Ask Dr. Adam.”
I-Connect007 has just released the latest episode of its podcast series, On the Line with..., which focuses on designing for reality in the electronics industry. In this episode, host Nolan Johnson talks with ASC Sunstone VP/Manager Matt Stevenson about CAD tool features and data formats that help designers make better decisions and transfer better designs to manufacturing.
TT Electronics, a leading provider of global manufacturing solutions and engineered technologies, proudly announces the grand opening of its newest manufacturing facility located in Mexicali, Mexico.
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer in response to the semiconductor manufacturing incentives announced by the U.S. Department of Commerce and GlobalFoundries.
One of my great joys as a grandfather of eight is spending time with them at the park. It doesn't take too long until I'm getting stuck on a slide that is too small for me or on the seesaw, with me on one side and them trying to lift me. At that point, they learn some harsh lessons in physics and how heavy Grandpa really is. A seesaw is a relatively simple device, but it’s a great way to explain a rather complex concept in PCB design: design tradeoffs. Each decision made throughout a design comes with inherent pros and cons.