Sunstone and I-007eBooks Launch Book on Designing for RealityOctober 24, 2022 | I-Connect007
Estimated reading time: 1 minute
I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality.
This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
Written by topic expert Matt Stevenson of Sunstone Circuits, this book covers the complete circuit board manufacturing process, taking readers on a virtual tour of the printed circuit manufacturing process, from choosing the right CAD tool, to additive/subtractive processes, and even touching on the art of PCB design.
Peer reviewer Duane Benson of Screaming Circuits, says, “I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening the hood and giving the reader that knowledge of the PC board fab process.”
Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available.
Look for other exciting titles, like:
- The Evolving PCB NPI Process
- Thermal Management with Insulated Substrates
- Stackups: The Design within the Design
- High Performance Materials
- System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
- …and more coming this fall
We hope you enjoy The Printed Circuit Designer’s Guide to… Designing for Reality.
For more information, contact:
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes09/21/2023 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum.
Join Scienscope at the Guadalajara Expo and Tech Forum, where innovation knows no bounds.
Cadence Design Systems, Inc. announced it has expanded its design IP portfolio on TSMC’s 3nm (N3E) process—most notably with the addition of the flagship Cadence® 224G Long-Reach (224G-LR) SerDes PHY IP, which has achieved first-pass silicon success.
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Guadalajara Expo and Tech Forum, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico.
For several years now, Motek/Bondexpo in Stuttgart has been a consistent part of Rehm Thermal Systems' trade fair calendar. The focused orientation of the trade fair on the process chain of joining/connecting through adhesive bonding, potting, sealing, and foaming makes it an ideal platform for Rehm, especially in the areas of Conformal Coating and Dispensing.