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Optimizing mSAP to Produce Flex for Biofluid Sensor Probes

10/17/2024 | Dean Neuburger,  Sheldahl Flexible Technologies
Improvements in flexible printed circuitry technology offer solutions that enable advancement in other technologies, enabling new circuit design and capability possibilities for customers’ applications. This article will overview advancements developed and implemented to produce a flexible circuit that meets new and challenging requirements for a customer’s medical application. This discussion will highlight development ideas more than details about the final processing scheme.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Introduction

10/16/2024 | I-Connect007 Editorial Team
Design for Manufacturing (DFM) is defined as the practice of designing printed circuit boards that meet not only the capabilities of the customer’s assembly manufacturing process, but also the capabilities of the board fabrication process to provide the highest reliability at the lowest possible cost. 

Connect the Dots: Designing for Reality—Pattern Plating

10/16/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.

Marcy’s Musings: Destination Metallization

10/17/2024 | Marcy LaRont -- Column: Marcy's Musings
To reach your intended destination, you must have some form of pathway or route upon which to travel. It is much the same with the metallized traces and features on a printed circuit board. They are how electrical signals and power are carried from one point to another in an electronic device. Copper is the most prevalent metal conductor, but other metals are also used to a lesser degree, including gold, silver, tin, and palladium.

Untapped Potential: Automating Warehouse Management Into the Present

10/15/2024 | Josh Casper, Horizon Sales
The push toward automation in electronics manufacturing has led to significant improvements in SMT and through-hole technology (THT) production. Today’s manufacturers are outfitted with precision pick-and-place machines, sophisticated inspection systems, and advanced solder deposition solutions. These investments reflect a broader industry trend toward automating high-value production tasks to boost efficiency, improve quality, and reduce headcount in a shrinking labor market. While the spotlight has rightly focused on automating SMT production, one crucial area remains woefully under-invested: materials storage and handling.
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