- smt007 Magazine
In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
- Events||| MENU
- smt007 Magazine
Material Management and ControlNovember 21, 2022 | Davina McDonnell, Cogiscan
Estimated reading time: 2 minutes
In a market that is trying to catch up with increasing customer demands and quickly ship products out the back door, no electronics manufacturing plant can afford to lose any time or resources during the production process. Manufacturers are forced to do more with less and get the most out of every single precious component.
When you finally get your hands on inventory, perhaps after months of delays due to part allocation or supply-chain snafus, it’s critical that not a single part is wasted. While reducing waste has always been a big focus for electronics manufacturers, it’s now a top concern for factories around the globe to ensure the right material is in the right place at the right time.
Getting Control of the Kitting Process
One area fraught with the possibility for material mismanagement is the kitting process. Considering most PCBAs today use hundreds of different components, kitting the materials for a production run can be both arduous and time consuming. In a fast-paced environment like electronics manufacturing, if the kitting process isn’t controlled and managed properly, it can expose a manufacturer to opportunities for waste.
With Cogiscan’s kitting control module, operators are precisely guided through the material picking process with a detailed kit list for each job—listing exactly where the components are located, how many are needed for the scheduled job, and precisely where they need to be loaded. Whether the components are sitting on stockroom shelves, or within an intelligent storage tower, the kit list will define the precise location.
As every factory runs a bit differently, this kitting module allows for custom-defined rules based on inventory consumption preferences. For example, a manufacturer can set up the system to pull materials based on FIFO rules, to consume partial reels first, or to select and kit reels that have enough components to get through that entire job to maximize line productivity and reduce material replenishment time. Each manufacturer has the freedom to customize the kitting preferences based on the real-time production environment.
Setup Control for the SMT Factory
Accurate kitting is only half the equation to ensure the right materials are selected and ready for production. The other important factor is the actual setup of materials and machines. With Cogiscan’s setup control module, manufacturers can verify that all the right elements are being used correctly. This includes validation of components, tooling, and consumables, as well as the machine program.
Instead of waiting until the job is running on the SMT line, manufacturers can verify accurate setup in the offline setting. So, if there is an error found in the setup configuration by the system, it can be corrected before being released to the line.
To read this entire article, which appeared in the November issue of SMT007 Magazine, click here.
Despite being a leader in R&D investment in semiconductors and packaging with greater than $50 billion per year, the U.S. has seen its market share decrease to less than 3% in areas like advanced packaging and advanced substrates. The cause for this market share erosion was a laser focus in Asian countries to attract semiconductors and advanced packaging investment through ecosystem development and incentives. If the U.S. is serious about changing the momentum to onshore advanced packaging and advanced substrates, an ecosystem approach to innovation and manufacturing incentives must be employed. It is not enough to have the most innovative technology if the supply chain and manufacturing economics do not deliver competitive commercial opportunities.
Visit Dymax at SMTA International 2023 Discover Innovative Light-Cure Solutions for Today’s Electronics09/21/2023 | Dymax
Dymax, a leading manufacturer of light-curing materials and equipment, will exhibit in booth 1526 at SMTA International 2023 in Minneapolis, MN, from October 10-11.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Z-zero founder Bill Hargin has been studying stackup design techniques for years. He developed the company’s PCB stackup planning software, and he wrote an I-Connect007 eBook, The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design. In this interview, Bill shares his thoughts on designing rigid-flex stackups, the challenges they bring, and what rigid board designers need to know about designing stackups in 3D. “Flexperts” Mark Finstad of Flexible Circuit Technologies and Nick Koop of TTM Technologies also offer insight into the many tradeoffs that rigid-flex designers face.
When I stop to consider the dynamics in our industry at this moment, I keep coming back to the idea of “convergence.” Aspects of our industry historically thought of as distinct and separate are blurring the lines and overlapping. As I look back on our coverage in the past five years, I see convergence taking place, moving like a glacier—slow and steady but with formidable force. In this issue of PCB007 Magazine, the three areas of convergence we consider are materials, advanced packaging, and UHDI.