-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Electronica 2022: Happy to Be Back in Munich
November 21, 2022 | Pete Starkey, I-Connect007Estimated reading time: 2 minutes

As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.
Arriving at Messestadt West, and peeling off our still-compulsory masks as we left the train, we were carried along in a throng of people eager to get to the turnstiles with entrance tickets for a real live show and a glimpse into the future.
Although over 2,000 exhibitors occupied the 14 halls of Messe München, our areas of interest were concentrated mainly in Halls A1 and B1 with occasional ventures into A3, B3 and C1.
What did we see? A full spectrum of electronics innovations, plenty of incremental improvements in equipment and materials, a few potentially disruptive technologies and a blurring of the boundaries between design rules customarily associated separately with printed circuit and semiconductor territories.
Lots of familiar faces, people not seen in real life since before the lockdown, some not for many years more. We may have been struggling just a bit to remember names, and grateful for badges with bold print.
A serious issue highlighted at the General Assembly of EIPC (the European Institute for the PCB Community) by their president Alun Morgan was the continuing decline in the number of PCB manufacturers in Europe, from over 500 in 2000 to less than 200 in 2019. The Russian invasion of Ukraine has added to the industry’s problems by driving a dramatic increase in the cost of energy. Further, with the materials supply chain having moved to Asia and the additional cost of freight, the European PCB industry is at a significantly disadvantaged position. EIPC planned to bring these matters to the attention of government, with particular emphasis on defence considerations.
Friday was, as might be expected, a relatively quiet day but official figures indicated an overall total of 70,000 visitors from around 100 countries and regions, with opportunities to visit 2,144 exhibitors, as well as a full supporting program of conferences, forums, practical presentations, and panel discussions.
On the bus to the airport on our way home (yes, predictably, in the rain), we reflected upon a splendid live-event experience but not without some real concerns about the future of our industry.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Smartphone Production Rises 4% QoQ in 2Q25 as Inventory Adjustment Ends
09/12/2025 | TrendForceTrendForce’s latest investigations reveal that global smartphone production reached 300 million units in 2Q25, up 4% QoQ and 4.8% YoY, driven by seasonal demand and the recovery of brands such as Oppo and Transsion following inventory adjustments.