- smt007 Magazine
In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
- Events||| MENU
- smt007 Magazine
Indium Corporation’s Khor Chee Wooi Promoted to Manufacturing Manager for Malaysian FacilitiesDecember 22, 2022 | Indium Corporation
Estimated reading time: Less than a minute
Indium Corporation is pleased to announce that Khor Chee Wooi has been promoted to the role of Manufacturing Manager for the company’s two Malaysian-based facilities.
Wooi ensures production quality, efficiency, productivity, machine utilization, and on-time delivery for a positive customer experience. He is responsible for implementing the manufacturing processes and best practices used at production facilities across the world in the company’s two Malaysian-based facilities. Khor also establishes benchmarks for the facilities’ manufacturing operations and implements changes and improvements for better performance.
Wooi has more than 14 years of experience in the manufacturing industry. Prior to joining Indium Corporation as a Senior Engineer in 2020, he worked as a Manufacturing Engineering Section Manager at First Solar for 12 years. Wooi was a key contributor to getting Indium Corporation’s Malaysian facilities ready for operations.
Wooi holds a bachelor’s degree in mechanical and manufacturing engineering from Liverpool John Moores University.
U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing09/22/2023 | GlobalFoundries
The U.S. Department of Defense (DoD) has awarded GlobalFoundries (Nasdaq: GFS) (GF) a new 10-year contract for a supply of securely manufactured, U.S.-made semiconductors for use across a wide range of critical aerospace and defense applications.
APCT, a leading name in the PCB and electronics industry, is delighted to announce the appointment of Peter Austin as its President and CEO, effective September 1. Peter takes the reins from former CEO, Steve Robinson, who has retired after years of dedicated service to the company.
Ever since high density interconnect (HDI) was created in 1982 by Hewlett-Packard to package its first 32-bit computer powered by a single chip, it has continued to evolve and provide the solutions for miniaturized products. The leading edge of HDI technology became the process used for organic flip-chip packaging for the semiconductor industry. The two distinct markets—IC substrates and product-system integration—are now colliding and utilizing the same ultra-HDI manufacturing processes.
KIC Revolutionizes Electronics Manufacturing with Innovative Solutions for Soldering and Curing Processes09/21/2023 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum.
Intraratio to Feature Industry-Leading Smart Manufacturing Solutions at SMTA Guadalajara Expo and Tech Forum 202309/21/2023 | Intraratio
Intraratio, a provider of enterprise software solutions, is pleased to announce its participation in the SMTA Guadalajara Expo and Tech Forum 2023.