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Indium Corporation Announces Two Updates to Suzhou Team
December 23, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation is pleased to announce two updates to its team based in Suzhou, China—Fiona Chen has been promoted to the position of Senior R&D Manager and Demi Yao has been promoted to the position of R&D Sintering Project Manager.
In her new role as Senior R&D Manager, Chen assists with the development and implementation of departmental vision, pillars, and best practices to achieve Indium Corporation’s mission of developing world-class materials. Additionally, she is responsible for building and managing the R&D staff at the company’s Suzhou facility. She leads her team in designing and performing laboratory R&D work to develop products on a timely basis to increase customer satisfaction and sales.
Chen joined Indium Corporation in 2008 as a Research Chemist. In 2014, she was promoted to R&D Manager, where she led her R&D team to success in the development of ultra-low-voiding Indium10.1HF solder paste and Cu sinter paste. Chen received her master’s degree in polymer science from Soochow University in China.
In her new role as R&D Sintering Project Manager, Yao manages the research and development of advanced sintering projects by identifying opportunities to collaborate with customers. She collaborates with, and uses input from, marketing and sales team members, as well as customers, to design and develop new materials.
Yao joined Indium Corporation in 2015 as a Research Scientist for sintering materials. In this role, she successfully developed Nano/MicroCu Sintering paste. Yao earned her Ph.D. from Central China Normal University in Wuhan. She was a member of the Chinese-American exchange Ph.D. program, where she studied at the University of Kentucky during the first year of her Ph.D. program. In 2017, Demi was awarded the IMPACT “Best Paper Award.”
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Nolan’s Notes: Soldering Technologies
12/03/2024 | Nolan Johnson -- Column: Nolan's NotesThere are schools of thought that soldering methods are similarly anachronistic but still useful enough not to be worth changing. While that may be true, I see that soldering technologies are experiencing significant changes. It might not be apparent on the surface, but changes are afoot, and there are some disruptive things underway as well.