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Cambridge, Intel and Dell Join Forces on UK’s Fastest AI Supercomputer

11/27/2023 | Cambridge University
The Cambridge Open Zettascale Lab is hosting Dawn, the UK’s fastest artificial intelligence (AI) supercomputer, which has been built by the University of Cambridge Research Computing Services, Intel and Dell Technologies.

Keysight, MediaTek Successfully Complete 5G New Radio and RedCap Interoperability Testing

11/23/2023 | BUSINESS WIRE
Keysight Technologies, Inc. and MediaTek have successfully completed 5G New Radio (NR) and 5G reduced capability (RedCap) interoperability development testing (IODT) based on the 3GPP Release 17 (Rel-17) standard. The testing verified the latest MediaTek 5G modem technologies using Keysight’s 5G Network Emulation Solutions.

IPC Applauds New U.S. Government Strategy for Advanced Packaging

11/22/2023 | IPC
The U.S. Government’s announcement of a national strategy for “advanced packaging” under the CHIPS for America Program is a big step toward ensuring the resiliency and security of the U.S. supply chain for advanced electronics.

iNEMI Packaging Tech Topic Series Webinar: LSI/PKG/PCB Co-Design

11/21/2023 | iNEMI
iNEMI Packaging Tech Topic Series Webinar, LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design will be held on November 28, 2023, by guest speaker Kazunari Koga, Zuken Inc.

DOD Awards $39.9 Million to Strengthen U.S. Supply Chains for PCBs

11/16/2023 | U.S. DoD
The Department of Defense announced an award of $39.9 million via the Defense Production Act Investment (DPAI) Program to Calumet Electronics Corporation to enhance capabilities to produce High-Density Build-Up (HDBU) substrates, which include High-Density Interconnect Printed Circuit Board (PrCB) cores and HDBU build-up layers.
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