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EdgeCortix Joins AI-RAN Alliance to Accelerate the Integration of AI and Next-gen RAN Infrastructure

12/20/2024 | EdgeCortix
EdgeCortix, a leading fabless semiconductor company specializing in power-efficient AI processing, today announced its membership in the AI-RAN Alliance.

GlobalFoundries Sets New Bar as Largest Semiconductor Company to Protect Innovation by Joining LOT Network

12/19/2024 | GlobalFoundries
GlobalFoundries (Nasdaq: GFS) (GF) and LOT Network announced that GF has joined the LOT Network, the world’s largest patent licensing platform and non-profit community of global companies committed to protecting themselves against costly litigation from patent assertion entities (PAEs). With this move, GF joins a community of more than 4,500 companies that include half of the top 20 largest U.S. patent holders, and half of the S&P Global 100 and Fortune 100.

SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era

12/18/2024 | SEMI
SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry. Themed

Honeywell, Sino Jet Expand Collaboration With New Memorandum Of Understanding

12/17/2024 | Honeywell
Honeywell announced that it has signed a memorandum of understanding (MoU) with Sino Jet at the Middle East and North Africa Business Aviation Association (MEBAA) show.

Toray Engineering Launches TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging

12/17/2024 | ACCESSWIRE
Toray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024.
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