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The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 13, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
“New year, new you.” That tagline seems to be everywhere right now. All five must reads this week reflect this theme. Does this apply to you and your company?
We have quite a duke’s mixture of articles. We’ve got AT&S outlining their market position on advanced packaging, and Auburn University doing research on smart manufacturing processes. Keysight is coordinating practical 6G research in Europe, Technica shares where they see the market growing, and SEMI adds new members to a key board responsible for market guidance. These five stories drew a lot of reader attention this week.
We only have one more normal work week, and then we're on the road. We hope to see you all at IPC APEX EXPO in San Diego. If you’re at the show, stop by and see us!
High-performance Computers: AT&S Works on Microchips of the Future
Published January 9
This announcement from AT&S defines the current semiconductor development challenges, and presents their vision of heterogenous integration. Though not naming any specifics, AT&S stakes claim as a leading force in developing these technologies. It is my opinion that this is more of a position statement than anything else, alerting us to what is to come from a major supplier of printed circuit boards and substrates.
How Smart are Your Manufacturing Processes?
Published January 6
The Interdisciplinary Center for Advanced Manufacturing Systems at Auburn University is looking for help with an extensive study on smart manufacturing processes across multiple manufacturing disciplines. The U.S. DoD is a key sponsor for this study. According to the news item, the survey takes 10 minutes and does not ask for sensitive information. If you participate they promise to share the final report with you as well.
Keysight Coordinates Pan-European 6G Testbed
Published January 6
Seems 5G is just rolling out, and already 6G work is underway. Among 35 projects authorized by the European Commission’s Smart Networks and Services Joint Undertaking (SNS JU), 6G-SANDBOX, is a pan-European testbed for 6G experimentation and validation of 5G-Advanced and 6G capabilities. As a part of 6G-SANDBOX, Keysight will act as the project coordinator. For me, the news itself was interesting, but the extensive line of quotes from project participants were a snapshot into European thinking on 6G.
Real Time with… IPC APEX EXPO: Technica Keeps the Heat on a Hot Market
Published January 9
As the leader of a firm representing multiple equipment and supplies manufacturers in both the EMS and PCB fab markets, Technica USA president and CEO, Frank Medina, has a commanding view of what’s happening in the industry. In this Real Time with... IPC APEX EXPO 2023 preview, I asked Frank what’s hot in the industry, and what visitors can expect to see from Technica at IPC APEX EXPO in San Diego. I’ll give you a hint: Not only is the EMS market expanding, but so too is PCB fabrication, and automation is on the minds of both groups of customers.
SEMI Board Welcomes New Members From Advantest, TEL US, Westerwood Global
Published January 10
The SEMI North America Advisory Board (NAAB) has added three new members: Colin Ritchie (Advantest); (Tokyo Electronic Ltd. US); and Nigel Wenden, (Westerwood Global). The NAAB Board provides guidance on SEMI Americas programs designed to advance the business interests of member companies and address significant challenges in the electronics manufacturing and design supply chain. Semiconductor continues to be the headwaters of the manufacturing flow, the new board members represent equipment, materials and technical staffing services, all three critical factors in growing U.S. based semiconductor manufacturing.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/25/2024 | Marcy LaRont, I-Connect007Just this month, the Fall issue of IPC Community was released, spotlighting the global activities of IPC and its members. SMT007 Magazine covers the scary situation around counterfeit components. Design007 Magazine is not playing tricks with its hard-hitting discussions about “partial HDI.” (If you are asking yourself what that is, you really need to take a look.) Finally, PCB007 Magazine’s alternate metallization issue offers some real treats, including an interview featured this past week with Carmichael Gugliotti of MacDermid Alpha. In you’re in the U.S., here’s to an early Happy Halloween.
Exploring Advanced PCB Final Finishing: DIG, RAIG Technologies
10/24/2024 | Rich DePoto, UyemuraIn this interview, Rich DePoto of Uyemura provides a deep overview and explanation of Reduction-assisted Immersion Gold (RAIG) and direct immersion gold (DIG) technology, and their applications and benefits when compared to traditional final finishes. He delves into the intricacies of electroless nickel corrosion and “black pad,” exploring its causes, consequences, and the measures that can be taken to mitigate this problem. This comprehensive overview will provide insight toward sound decision-making for those operating in environments where perfect process control is a challenge.
2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future
10/24/2024 | IPCThe 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.
Highlights of the ICT 50th Anniversary Symposium
10/24/2024 | Pete Starkey, I-Connect007Why does it always rain when I attend these events? Temperatures were dropping, daylight was shrinking, and there were seasonal colour changes in wet hedgerows as I travelled to Gloucestershire for the 50th Anniversary Symposium of the Institute of Circuit Technology at Puckrup Hall near Tewkesbury in mid-October. It was a memorable occasion: Nostalgic for my contemporaries who remembered our industry at its most prosperous, technically outstanding in the quality and significance of presentations to an attentive audience of printed circuit professionals, and complemented by the sharing of ideas, information, and trade gossip within a friendly community at the evening gathering.
Global Citizenship: Comparing and Contrasting the U.S. and China PCB Industries
10/23/2024 | Tom Yang -- Column: Global CitizenshipI have spent a lot of time in the U.S., and one question I am frequently asked is about the differences between the Chinese and U.S. PCB industries. It’s always an interesting question, and I will try to answer it in this month’s column. Certainly, the U.S. was the leader in PCB manufacturing, including developing the processes and technology, which it taught to the Chinese in the late 1980s and ’90s. As a result, China has become a force to be reckoned with in the global PCB market. Having been educated in America and now leading a major PCB manufacturing company in China, I have a unique vantage point when it comes to comparing the two nations’ approaches to PCB production.