It’s Only Common Sense: Selling to Today's Generation of Buyers
Dan’s Biz Bookshelf: ‘Believe in Better'
The Big Picture: Our Big ‘Why’ in the Age of AI
IPC Announces New Board Members at IPC APEX EXPO 2023
January 25, 2023 | IPCEstimated reading time: 1 minute
At the 66th IPC Annual Meeting on January 24, held in conjunction with IPC APEX EXPO 2023, the IPC Board of Directors announced new and second-term members. Board members serve a four-year term, and the student board member serves a one-year term.
The newly elected Board Members are:
- First-time Board Member: Paul Baldassari, Executive Vice President, Worldwide Operations, Flex
- First-time Board Member: Meredith LaBeau, Chief Technology Officer, Calumet Electronics
- Second-term Board Member: Foo-Ming Fu, Chairman and CEO, HaiNa Cognitive Connections (HCC)
- Second-term Board Member: Carsten Salewski, Executive Board Member, Sales, Marketing and International Business, Viscom AG
- Student Board Member: Henry Crandall, University of Utah
"IPC is privileged to add these outstanding industry professionals to our current slate of Board members,” said John W. Mitchell, IPC president and CEO. “We look forward to working with them as we work to advance the global electronics manufacturing industry to build electronics better.”
In addition to Board election announcements, IPC honored three outgoing Board Members:
- Nilesh Naik, Eagle Circuits
- Peter Cleveland, Taiwan Semiconductor Manufacturing Co.
- Hannah Nelson, Valparaiso University
Added Mitchell, “IPC expresses its sincere gratitude to Nilesh, Peter and Hannah for their dedicated service to the IPC Board. All three shared their expertise with IPC and industry – we thank them for imparting their knowledge and helping guide IPC to best serve our members and the global electronics community.”
Share on:
Suggested Items
Compal Announces Completion of New Automotive Electronics Facility in Poland, Signaling Strategic Growth in Europe
06/30/2025 | Compal Electronics Inc.Compal Electronics is proud to announce the completion of Phase One of its new manufacturing facility in Czeladź, Silesian Voivodeship, Poland, marking a major milestone in its strategic expansion into the European automotive electronics market.
Leadership Development Continues at Incap Slovakia
06/30/2025 | IncapIncap Slovakia has launched the first leadership development training of 2025 as part of its ongoing Team Leaders Academy programme.
Flexible Electronics Market to Reach $66.9 Billion by 2032, Growing at a CAGR of 9.2% from 2025
06/30/2025 | PRNewswireThe flexible electronics market is projected to reach $66.9 billion by 2032, up from an estimated $38.4 billion in 2025, growing at a robust CAGR of 9.2% during the forecast period.
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.